Elastic Member Alignment for Radiation Sensor Height Uniformity
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Solution Overview
Problem
Variations in the height of semiconductor layers in radiation detection apparatuses due to manufacturing errors lead to reduced radiation detection accuracy.
Innovation Solution
Incorporating an elastic member between the sensor units and a support member, with a substrate covering the radiation incident surface, to align and stabilize the semiconductor layers, thereby reducing height variations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If multiple tiles with semiconductor layers are attached side by side to a frame, then the radiation detection apparatus can cover a larger area, but variation in the thickness of the integrated circuit causes variation in the height of the semiconductor layer from the frame, reducing radiation detection accuracy
Solution Approach 1:
A resin layer is introduced as an intermediary substance between the integrated circuit and the frame. This resin layer fills the gaps caused by thickness variations in the integrated circuit, providing a cushioning effect that maintains consistent height of semiconductor layers across all tiles, thereby resolving the height uniformity issue while preserving the large detection area
Solution Approach 2:
The resin layer is applied in advance to compensate for potential height variations before the semiconductor layers are fully assembled. By pre-filling the gaps with resin material, the system proactively prevents height inconsistencies from affecting radiation detection accuracy, rather than attempting to correct them after assembly
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The elastic member ensures consistent alignment of semiconductor layers, enhancing radiation detection accuracy by minimizing variations in height and improving the uniformity of radiation detection across the apparatus.
Implementation Method 1
an elastic member located between the second surface of each of the plurality of sensor units and the support member; and a substrate that covers the first surface of each of the plurality of sensor units, wherein the elastic member presses each of the plurality of sensor units toward the substrate
Data Source
AI summary
A radiation detection apparatus includes a plurality of sensor units each including a semiconductor layer that converts radiation into a charge, a first surface located on a radiation incident side, and a second surface located on an opposite side to the first surface, a support member, an elastic member located between the second surface of each of the plurality of sensor units and the support member, and a substrate that covers the first surface of each of the plurality of sensor units. The elastic member presses each of the plurality of sensor units toward the substrate.