Angled Elastic Solder Brackets for Durable PCB Component Mounting

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing methods for fixing electromechanical components on circuit boards using solder connections are prone to failure under high mechanical loads due to inadequate durability of the solder connections.

Innovation Solution

A component with elastically yielding brackets, formed on opposing sides of a basic body, provides multiple soldering surfaces arranged at angled orientations, allowing for elastic compensation in multiple directions, enhancing the durability of solder connections under mechanical stress.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If components are fixed to the circuit board by means of a solder connection, then electrical connection is established, but the solder connection is exposed to high stresses under mechanical loads which may result in total failure

Engineering Contradiction:
Improvedurability of solder connectionVSAvoidmechanical load resistance
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

The bracket is designed as an elastically yielding component that can dynamically adapt to mechanical stresses. The angled configuration allows the bracket to flex and deform elastically under load, absorbing stress that would otherwise be transmitted to the solder connection, thereby maintaining reliability under varying mechanical conditions

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The bracket changes its physical state from rigid to elastically deformable under mechanical load. By designing the bracket with specific angular orientations (e.g., 45 degrees to the board surface), it undergoes controlled elastic deformation that absorbs mechanical energy, preventing stress concentration at the solder joint and maintaining connection integrity

Inventive Principle:
Principle #35Parameter changes

2Strength

If multiple solder connections are used to fix electromechanical components, then mechanical strength is improved, but the solder connection is still exposed to high stresses which may result in total failure

Engineering Contradiction:
Improvemechanical strength of fixationVSAvoidsolder connection durability
Core Design Contradiction:
StrengthVSReliability

Solution Approach 1:

The elastically yielding bracket acts as an intermediary element between the component and the circuit board. It absorbs and distributes mechanical stresses through its flexible structure, preventing direct stress transmission to the solder connections. This mediator function protects the solder joints from high stresses even when multiple connections are used

Inventive Principle:
Principle #24Intermediary (Mediator)

3Strength

If adhesive film is used to fix electromechanical components, then mechanical loads are absorbed, but the film is damaged in the reflow process

Engineering Contradiction:
Improvemechanical load absorptionVSAvoidcompatibility with reflow process
Core Design Contradiction:
StrengthVSEase of manufacture

Solution Approach 1:

The solution changes the material parameter from temperature-sensitive adhesive film to thermally stable elastically yielding bracket. The bracket maintains its mechanical properties throughout the reflow process temperature range, allowing it to absorb mechanical loads without being damaged by the thermal cycling inherent in reflow soldering

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The angled brackets enable effective prevention of solder connection breakage by allowing elastic deformation, ensuring durability and stability under high mechanical loads, particularly in multi-side SMD mounting.

Implementation Method 1

two elastically yielding brackets, which are formed on opposing sides of the basic body and respectively form one soldering surface... The main surfaces of the first portion and the main surfaces of the second portion are arranged at an angle to each other... allowing elastic compensation in multiple directions

Methodology Applied
Scientific EffectElastic deformation: Elasticity

Data Source

PatentUS12588144B2Component for surface soldering installation on a circuit board, associated use and assembly
Publication Date: 2026.03.24 PREH GMBH
  • US12588144B2 patent drawing
  • US12588144B2 patent drawing

AI summary

The present disclosure relates to a component for the surface soldering installation on a circuit board, comprising: a basic body forming at least one locating surface provided for contact with a surface of the circuit board, or several locating points spanning a plane; two elastic brackets, which are formed on opposing sides of the basic body and respectively form one soldering surface for a solder connection with a positioning surface of the circuit board, wherein each of the two brackets has, in sequential arrangement over its course from the basic body to the soldering surface, a strip-shaped, flat, first portion and a strip-shaped, flat, second portion, wherein the main surfaces of the first portion are arranged at an angle to the main surfaces of the second portion; a use and an associated assembly.