Elastic Substrate Pad With Inclined Surface
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Solution Overview
Problem
Substrate positional misalignment during transfer in substrate transfer devices is a persistent issue due to the lack of effective gripping mechanisms that can handle warped or bent substrates and ensure secure attachment and easy detachment.
Innovation Solution
A novel substrate mounting pad with a base portion and a main portion featuring a slope and a holding portion that can accommodate warped substrates, providing a varying contact area and holding force based on the substrate's weight, and is designed to be easily attachable and detachable, with the holding portion positioned to prevent sliding and featuring adjustable thickness and shape for improved flexibility and durability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional pad is used on the hand of the transfer robot, then the substrate can be prevented from slipping, but positional misalignment of the substrate on the end effector occurs
Solution Approach 1:
The pad transitions from a conventional flat structure to a three-dimensional structure with an inclined surface. The inclined surface creates a vertical height difference that transforms the gripping mechanism from a simple horizontal contact to a multi-dimensional engagement, where the substrate is held at an angle rather than flat against the hand surface.
Solution Approach 2:
The pad employs an inclined surface that creates a curved or angled contact geometry rather than a flat plane. This curvature allows the pad to accommodate warped or bent substrates by providing a gradual transition surface, enabling the substrate to conform to the pad's geometry while maintaining secure contact.
2Adaptability or versatility
If the pad structure is made more complex to improve gripping capability, then warped substrates can be handled better, but the device complexity increases
Solution Approach 1:
The pad applies local quality by creating a specific inclined surface geometry at the contact region rather than making the entire pad structure complex. The base portion remains simple while the main portion featuring the inclined surface provides the specialized functionality needed for handling warped substrates.
Solution Approach 2:
The pad is constructed as a flexible component with a thickness of 1 mm to 10 mm, allowing it to deform and conform to warped substrates. This flexibility enables the pad to adapt to various substrate shapes without requiring a complex rigid structure, maintaining simplicity while achieving high adaptability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The pad effectively suppresses substrate misalignment by providing a secure grip and easy handling of warped substrates, enhancing the flexibility and durability of the gripping mechanism, and facilitating easier attachment and detachment compared to conventional pads.
Implementation Method 1
The main portion has elasticity. The main portion forms a space below the second end.
Data Source
AI summary
A pad for an end effector of a substrate transfer device is provided. The pad includes a base portion and a main portion. The main portion is in continuity with the base portion in a first direction. The main portion includes a lower surface, a first end, a second end, and an upper surface. The first end is one end of the main portion in a second direction perpendicular to the first direction. The second end is the other end of the main portion in the second direction. A distance between a reference surface including the lower surface and the upper surface increases from the first end to the second end. The upper surface has a maximum height at the second end with respect to the reference surface. The main portion has elasticity. The main portion forms a space below the second end.