Elastic Suction Stage for Flat Bonding Material Application
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Solution Overview
Problem
Insulated circuit substrates in semiconductor devices often warp, making it difficult to apply bonding materials uniformly and accurately to predetermined regions, leading to potential electrical failures and reduced reliability of the semiconductor module.
Innovation Solution
A bonding material application apparatus featuring a base with suction holes and an elastic sheet with through holes that surround the suction holes, ensuring the substrate is securely fixed and kept flat, preventing suction paths and ensuring precise application of bonding materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If suction is applied through suction holes to fix the substrate, then the substrate is securely fixed, but the substrate surface becomes uneven due to warpage, making it difficult to apply bonding material properly
Solution Approach 1:
An elastic sheet is placed over the suction holes to provide flexible, uniform contact with the substrate surface. The elastic material deforms to accommodate substrate warpage while maintaining consistent suction pressure, keeping the substrate flat without creating uneven contact points that would interfere with bonding material application.
Solution Approach 2:
The elastic sheet acts as an intermediary between the rigid suction holes and the substrate. It mediates the suction force distribution across the substrate surface, ensuring uniform fixing while maintaining substrate flatness, thereby enabling precise bonding material application.
2Shape
If the substrate is corrected to be flat by suction, then the substrate surface becomes flatter, but the substrate does not become completely flat, still making it difficult to apply bonding material properly
Solution Approach 1:
The elastic sheet provides continuous, flexible contact across the entire substrate surface, distributing suction force uniformly. This flexibility allows the sheet to adapt to residual warpage while maintaining overall substrate flatness sufficient for precise bonding material application.
Solution Approach 2:
The elasticity of the sheet allows dynamic adjustment of contact pressure distribution. The material's physical property enables it to deform and conform to the substrate shape, achieving optimal flatness through elastic deformation rather than rigid constraint.
3Reliability
If suction holes are used to fix the substrate, then the substrate is held in place, but suction paths may form allowing bonding material to spread beyond intended regions
Solution Approach 1:
The elastic sheet covers the suction holes completely, creating a sealed barrier that prevents bonding material from contacting the suction holes. The flexible material conforms to the substrate while maintaining this seal, preventing suction paths that would cause material spread.
Solution Approach 2:
The elastic sheet serves as an intermediary barrier between the bonding material and the suction holes. It allows suction to occur through the sheet while preventing direct contact between the material and suction openings, thus eliminating suction paths.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively keeps the substrate flat, preventing bonding material spread beyond intended regions, thus enhancing the reliability of semiconductor modules by ensuring accurate and uniform application of bonding materials.
Implementation Method 1
a suction unit configured to apply the suction for suctioning the target member to be placed in the stage region in the suction direction through suction holes among the plurality of suction holes, which are respectively disposed at positions immediately below respective ones of the plurality of through holes, thereby to fix the target member to the stage region by the suction via the elastic member
Data Source
AI summary
An apparatus includes a base having a stage region at a front side thereof, and a plurality of suction holes in the stage region; an elastic member provided in the stage region and having a plurality of through holes, each of which is disposed at a position immediately above a corresponding one suction hole when viewed from a suction direction from the front side to a rear side of the base; and a suction unit configured to apply suction for suctioning a target member to be placed in the stage region through the suction holes in the suction direction, thereby to fix the target member to the stage region by the suction via the elastic member.