Elastic Terminal Block Structure for Fine-Pitch Test Connectors

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Solution Overview

Problem

Conventional probe arrays for testing semiconductor integrated circuits face issues with reduced reliability and yield due to uneven wear and crooked terminals caused by small pitches and external forces, leading to decreased service life and increased manufacturing costs.

Innovation Solution

A test connector device with a base, terminal block, and limiting member, featuring elastic designs and adjustable structures to maintain terminal direction and prevent crooking, along with a manufacturing method that ensures high conductivity and low impedance, allowing for improved assembly and flexibility.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If the pitch of the probe array is reduced to meet increasing electrical connection demands, then the chip capacity per unit area is improved, but the probes experience uneven wear and reduced service life due to scratching between tips and contact pads/bumps

Engineering Contradiction:
Improvechip capacity per unit areaVSAvoidprobe service life
Core Design Contradiction:
Quantity of substanceVSReliability

Solution Approach 1:

The terminal block incorporates elastic terminals that can dynamically adjust their position and absorb mechanical stress through elastic deformation. This dynamic capability allows the terminals to accommodate pitch variations and external forces without suffering permanent damage or uneven wear, thereby extending service life while maintaining fine-pitch connectivity

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The patent changes the mechanical parameters of the terminal block by introducing elastic materials and spring-loaded structures. This allows the terminal to vary its contact pressure and positional parameters in response to external forces, preventing uneven wear while maintaining the fine pitch required for high-density chip connections

Inventive Principle:
Principle #35Parameter changes

2Manufacturing precision

If the probe size is reduced to micron-scale to meet fine-pitch requirements, then the electrical connection density is improved, but the probes become more susceptible to external forces causing crooked terminals and reduced test reliability

Engineering Contradiction:
Improvepitch precisionVSAvoidtest reliability
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The terminal block incorporates elastic elements and shock-absorbing structures that provide beforehand cushioning against external forces. This pre-positioned mechanical cushioning protects the fine-pitch terminals from crooking and damage before external forces can cause permanent deformation, thereby maintaining both precision and reliability

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

Solution Approach 2:

The patent employs flexible elastic terminals that can bend and deform elastically to absorb external forces. This flexibility allows the terminal structure to accommodate mechanical stress without transmitting damaging forces to the fine-pitch contact points, preventing crooked terminals while maintaining manufacturing precision

Inventive Principle:
Principle #30Flexible shells and thin films

3Ease of manufacture

If conventional rigid terminal structures are used, then the assembly is simple, but the terminals are prone to crooking due to external forces and lack support for the component being tested

Engineering Contradiction:
Improveassembly simplicityVSAvoidterminal directional stability
Core Design Contradiction:
Ease of manufactureVSStability of the object's composition

Solution Approach 1:

The terminal block transitions from rigid to dynamic elastic structures that can adapt to external forces. The elastic terminals maintain their directional stability through controlled elastic deformation rather than rigid resistance, preventing crooking while remaining manufacturable through standard elastic component fabrication processes

Inventive Principle:
Principle #15Dynamics

4Productivity

If high-density terminal arrangements are implemented to increase test capacity, then the productivity is improved, but the impedance increases causing temperature rise and reduced transmission efficiency

Engineering Contradiction:
Improvetest capacityVSAvoidimpedance-related temperature rise
Core Design Contradiction:
ProductivityVSTemperature

Solution Approach 1:

The patent optimizes electrical parameters by using elastic terminals with controlled contact pressure and optimized material properties. This changes the electrical resistance and impedance characteristics of the terminal block, allowing high-density arrangements to maintain lower impedance and reduced temperature rise while preserving high test capacity

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS12379394B2Test connector device and manufacturing method of terminal block thereof
Publication Date: 2025.08.05 SUYIN OPTRONICS
  • US12379394B2 patent drawing
  • US12379394B2 patent drawing
  • US12379394B2 patent drawing

AI summary

The present invention provides a test connector device for testing a component to be tested having conductive portions. The test connector device includes a base, a terminal block, and a limiting member. The terminal block is disposed on the base. The terminal block includes a substrate and terminals arranged in multiple rows and formed in an integral form with the substrate. Each of the terminals includes a first contact end and a second contact end corresponding to each other. The component to be tested is placed on the limiting member and movably assembled to one side of the base. The limiting member includes a positioning assembly and limiting slots where the first contact ends protrude out. The positioning assembly is movably fastened to the base, so that the first contact ends contact the conductive portions. Accordingly, the present invention enhances reliability, stability, and transmission efficiency during tests.