Elastic Test Socket Structure for IC Warpage and Short-Circuit Isolation
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Solution Overview
Problem
Conventional test sockets face challenges in maintaining reliable electrical contact while accommodating various IC chip sizes and configurations, and they are prone to short circuits and wear due to inflexibility and material durability issues.
Innovation Solution
A test socket design featuring an insulating support structure with elastic conductive posts covered by an insulating material layer, combining rigid and soft frames made of materials like polyimide and silicone, and a manufacturing method involving through holes and sacrificial layers to ensure stable and durable connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If rigid conductive elements are used in test sockets, then structural stability is improved, but adaptability to various IC chip sizes and configurations deteriorates
Solution Approach 1:
The patent employs flexible conductive posts with elastic properties that can deform to accommodate different IC chip sizes and configurations. These posts are embedded in an insulating support structure, combining the stability of a rigid framework with the adaptability of flexible contact elements. The flexible posts can bend and adjust their position to maintain reliable electrical contact across various chip dimensions.
Solution Approach 2:
The test socket utilizes composite construction combining rigid insulating support structure with flexible conductive elements. The insulating support provides structural stability while the flexible conductive posts provide adaptability. This composite approach allows the socket to maintain its overall shape and position while the conductive elements adapt to different chip configurations.
2Productivity
If conductive elements are densely arranged to improve testing efficiency, then productivity is improved, but the risk of short circuits increases
Solution Approach 1:
The patent introduces an insulating material layer that coats the conductive posts, serving as an intermediary barrier between adjacent conductive elements. This insulating coating allows dense arrangement of conductive posts for high productivity while preventing electrical short circuits by maintaining electrical isolation between neighboring elements even when they are in close proximity.
Solution Approach 2:
A thin insulating film or coating is applied to the surface of each conductive post. This thin film provides sufficient electrical insulation to prevent short circuits between densely packed conductive elements while allowing the posts to maintain their flexible, deformable structure for reliable contact.
3Adaptability or versatility
If frequent insertion and removal of IC chips is performed, then testing flexibility is improved, but durability of the test socket deteriorates
Solution Approach 1:
The conductive posts are designed with elastic properties, allowing them to flexibly deform during insertion and removal operations. This elasticity enables the posts to absorb mechanical stress and wear from frequent operations, maintaining their functional integrity and electrical contact capability over extended use, thereby improving both testing flexibility and socket durability.
4Adaptability or versatility
If conductive posts are made elastic to improve adaptability, then adaptability to IC warpage is improved, but reliability of electrical contact deteriorates due to potential short circuits
Solution Approach 1:
The insulating material layer coating the conductive posts acts as an intermediary that allows the posts to be elastic and adaptable to IC warpage while preventing the short circuits that would otherwise result from such flexibility. The insulating coating maintains electrical isolation even when the conductive posts deform to accommodate warped IC surfaces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides reliable, flexible, and durable IC chip testing by preventing short circuits and ensuring accurate test results through adaptable and durable electrical connections.
Implementation Method 1
elastic conductive posts... The soft support frame is made of silicone, which offers the flexibility required to accommodate variations arising from IC package warpage or BGA solder ball size tolerances
Implementation Method 2
at least a portion of their circumferential surfaces is covered by an insulating material layer, which is designed to prevent electrical short circuits
Data Source
AI summary
A test socket for testing integrated circuit (IC) chips and a manufacturing method for the test socket are disclosed. The test socket comprises an insulating support structure having a plurality of through holes and a plurality of elastic conductive posts. The conductive posts are partially embedded in the support structure and extend through the through holes to accommodate variations due to IC package warpage and ball grid array (BGA) solder ball size tolerances. The insulating support structure further includes grooves adjacent to the through holes to securely fasten the conductive posts. Each conductive post features an elastic structure with at least a portion of its circumferential surface covered by an insulating material layer to prevent short circuits. The test socket further comprises a rigid support frame—potentially made of polyimide, PCB material, or ceramic—and a soft support frame made of silicone, which is both durable and flexible.