Elastic Conductive Pillar Test Socket for High-Frequency Package Testing
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Solution Overview
Problem
Conventional test sockets for semiconductor packages face issues such as damage to solder balls, high resistance, and signal integrity problems, particularly in high-frequency testing, due to their design and material properties.
Innovation Solution
A test socket design incorporating a first connection structure with conductive plugs and a second connection structure with elastic conductive pillars formed by conductive particles, providing improved conductivity and durability, and a test apparatus that includes a socket board with contact pads for reliable electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional test sockets are used for testing semiconductor packages, then electrical connection is achieved, but damage to solder balls occurs and reliability deteriorates
Solution Approach 1:
The patent changes the material parameter of the contact structure from conventional rigid materials to elastic material, and changes the contact mechanism from sliding/friction contact to elastic deformation contact. The elastic conductive pillars deform elastically under external pressure to establish electrical connection, avoiding damage to solder balls while maintaining reliability
Solution Approach 2:
The patent uses composite material structure combining elastic material with conductive particles (such as metal powder) within the elastic matrix. This composite structure provides both elastic deformation capability and electrical conductivity, resolving the contradiction between reliability and damage prevention
2Reliability
If conventional test socket designs are used, then basic electrical connection is achieved, but resistance is high and signal integrity deteriorates in high-frequency testing
Solution Approach 1:
The elastic conductive pillars are formed by mixing conductive particles (metal powder) with elastic material, creating a composite structure that provides both elasticity and high electrical conductivity. This reduces electrical resistance and improves signal integrity for high-frequency testing while maintaining the elastic contact mechanism
Solution Approach 2:
The patent concentrates high conductivity material (conductive particles) specifically in the contact regions where electrical connection is needed, while the bulk material remains elastic. This local quality optimization reduces resistance at critical interfaces without compromising overall elastic properties
3Power
If conventional test sockets are used, then testing function is provided, but current consumption handling capability is limited and external terminals are damaged
Solution Approach 1:
The patent changes the mechanical parameter of the contact structure from rigid to elastic, allowing the elastic conductive pillars to deform and accommodate varying contact pressures. This elastic deformation capability enables the structure to handle higher current loads without damaging external terminals, as the contact pressure can be optimized and maintained within safe limits
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The new design offers wider contact area, better high-frequency performance, and the ability to handle higher current consumption without damaging external terminals, extending the life span of the test socket.
Implementation Method 1
the second insulating body being elastic, and the plurality of elastic conductive pillars being formed by arranging a plurality of conductive particles in the second insulating body
Implementation Method 2
the conductive particles in each of the plurality of elastic conductive pillars can produce electrical conductivity in response to an external pressure applied onto the elastic conductive pillar
Data Source
AI summary
A test socket and a test apparatus for testing a semiconductor package are provided. The test socket includes: a first connection structure including a first insulating body and a plurality of conductive plugs within the first insulating body; and a second connection structure disposed on the first connection structure and including a second insulating body and a plurality of elastic conductive pillars, the second insulating body being elastic, and the plurality of elastic conductive pillars being formed by arranging a plurality of conductive particles in the second insulating body in a vertical direction; wherein the plurality of elastic conductive pillars are in vertical alignment with the plurality of plugs of the first connection structure, respectively, and the conductive particles in each of the plurality of elastic conductive pillars can produce electrical conductivity in response to an external pressure applied onto the elastic conductive pillar.