Elastic Rotating Tool Local Polishing for Optical Surface Precision

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Solution Overview

Problem

Conventional corrective polishing methods face challenges in maintaining stable machining amounts, achieving high spatial resolution, and increasing costs due to tool wear and complex equipment requirements, especially when dealing with optical elements that require precision down to nanometer accuracy.

Innovation Solution

A local polishing method using organic particles with an average size of 5 μm or more, dispersed in a liquid, and a rotating tool made of elastic material, which reduces tool wear and maintains surface roughness, allowing for stable machining and miniaturization of the polishing device.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional local polishing with fine abrasive grains (1 μm) is used, then machining precision is improved, but tool wear increases and machining stability deteriorates

Engineering Contradiction:
Improvemachining precisionVSAvoidmachining stability
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The patent changes the particle size parameter of abrasive grains from conventional fine grains (1 μm) to coarse grains (5 μm or more), which fundamentally alters the machining mechanism. This parameter change reduces tool wear and stabilizes pressing force while maintaining acceptable machining precision through controlled residence time distribution

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent introduces an elastic rotating tool as an intermediary between the pressing mechanism and the workpiece. This elastic tool absorbs pressing force fluctuations and prevents direct metal-to-metal contact, thereby stabilizing the machining process and reducing tool wear

Inventive Principle:
Principle #24Intermediary (Mediator)

2Area of stationary object

If conventional local polishing is performed with scanning, then coverage area is improved, but machining amount stability deteriorates due to tool wear and pressing force fluctuation

Engineering Contradiction:
Improvecoverage areaVSAvoidmachining amount stability
Core Design Contradiction:
Area of stationary objectVSReliability

Solution Approach 1:

The patent implements feedback control by measuring the actual pressing force and residence time distribution, then using this information to optimize the scanning path and speed. This closed-loop control compensates for tool wear and pressing force fluctuations, maintaining stable machining amounts over large coverage areas

Inventive Principle:
Principle #23Feedback

Solution Approach 2:

The patent transitions from static pressing to dynamic scanning with controlled residence time. By making the tool move along predetermined paths with optimized停留 times, the system achieves both large coverage area and stable machining amounts, as the dynamic process compensates for tool wear effects

Inventive Principle:
Principle #15Dynamics

3Reliability

If non-contact EEM method is used, then tool wear is reduced, but device complexity and size increase

Engineering Contradiction:
Improvetool wear resistanceVSAvoiddevice complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent replaces the complex non-contact EEM system with a simplified mechanical approach using elastic tools and coarse abrasive grains. This substitution achieves similar tool wear resistance through mechanical means rather than requiring complex viscosity control and circulation systems

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent uses inexpensive elastic rotating tools with coarse abrasive grains that can be easily replaced. This approach eliminates the need for expensive, complex non-contact equipment while achieving comparable tool life through simple, replaceable components

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

4Productivity

If non-contact EEM method is used with high rotation speed, then machining speed is improved, but spatial resolution deteriorates

Engineering Contradiction:
Improvemachining speedVSAvoidspatial resolution
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The patent uses dynamic scanning with controlled residence time to achieve both high machining speed and high spatial resolution. By optimizing the scanning path and停留 time at each location, the system can correct small undulations (high spatial resolution) while maintaining fast overall machining speed

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The patent changes the fundamental machining parameters from high-speed non-contact EEM to controlled-speed local polishing with coarse grains. This parameter change enables precise control of material removal at each location, achieving high spatial resolution while maintaining practical machining speeds through optimized residence time distribution

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method prevents tool wear, stabilizes machining, and achieves high spatial resolution while reducing costs and maintaining surface quality, enabling precise polishing of optical elements with improved surface roughness and machining stability.

Implementation Method 1

a rotating tool (11) locally pressed against the work (9)

Methodology Applied
Scientific EffectElastic deformation: Elasticity

Implementation Method 2

supplying polishing slurry composed of fine abrasive grains between the work and the rotating tool

Methodology Applied
Scientific EffectAbrasion: Abrasion

Data Source

PatentUS20210331283A1Local polishing method, local polishing device, and corrective polishing apparatus using the local polishing device
Publication Date: 2021.10.28 NATSUME OPTICAL
  • US20210331283A1 patent drawing
  • US20210331283A1 patent drawing
  • US20210331283A1 patent drawing

AI summary

Provided is a local polishing technique suitable for corrective polishing. Press polishing is performed while supplying a polishing solution between a work and a work-polishing rotating tool locally pressed against the work, the polishing solution having abrasive grains composed of organic particles with an average particle size of 5 μm or more dispersed in a liquid. The rotating tool is made of an elastic material.