Conductive Via With Elastic Member for Crack-Resistant Wafer Bonding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The semiconductor industry faces challenges in integrating smaller components with increased complexity, which can lead to manufacturing difficulties such as crack formation and damage during wafer-to-wafer bonding processes.
Innovation Solution
Incorporating an elastic member within a conductive via of a semiconductor structure, which can absorb bonding forces and thermal stress, thereby minimizing the risk of cracks and damage during the bonding process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If wafer-to-wafer bonding process is performed with smaller components and increased integration density, then manufacturing precision and integration density are improved, but crack formation and structural damage occur due to bonding forces and thermal stress
Solution Approach 1:
An elastic member is disposed within the conductive via before the wafer-to-wafer bonding process to absorb bonding forces and thermal stress that will be generated during bonding, preventing crack formation and structural damage in advance
Solution Approach 2:
The elastic member acts as an intermediary element between the conductive via and the surrounding substrate/passivation layer, absorbing mechanical stress and thermal expansion forces to protect the bonded structure from damage
2Reliability
If conductive via is made taller to accommodate elastic member, then stress absorption capability is improved, but via complexity and manufacturing difficulty increase
Solution Approach 1:
The elastic member is nested within the conductive via, with the dielectric liner surrounding both the via and the elastic member, creating a compact multi-layer structure that maximizes stress absorption within limited space
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The elastic member effectively absorbs bonding forces and thermal stress, reducing the likelihood of cracks and damage in the bonded semiconductor structure, thus enhancing manufacturing reliability.
Implementation Method 1
an elastic member disposed within the conductive via
Implementation Method 2
a dielectric liner between the conductive via and the wafer, and between the conductive via and the passivation layer
Data Source
AI summary
The present application provides a semiconductor structure having an elastic member within a via. The semiconductor structure includes a wafer including a substrate, a dielectric layer under the substrate, and a conductive pad surrounded by the dielectric layer; a passivation layer disposed over the substrate; a conductive via extending from the conductive pad through the substrate and the passivation layer and partially through the dielectric layer; and an elastic member disposed within the conductive via.