Elastic Wave Filter Thermal Layout for IDT Heat Dissipation
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Solution Overview
Problem
Existing elastic wave filter apparatuses suffer from inadequate heat dissipation due to insufficient thermal conductivity, leading to inefficient heat management when the IDT electrode is driven and generates heat.
Innovation Solution
Incorporating a heat diffusion layer made of high thermal conductivity material, such as metal, on the piezoelectric substrate that overlaps the IDT electrodes, connected via plating films, which enhances heat dissipation by diffusing heat away from the IDT electrodes through the substrate and terminals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional elastic wave filter apparatus with IDT electrodes and wiring electrodes on a piezoelectric substrate is used, then the device can perform elastic wave filtering, but heat dissipation is insufficient when the IDT electrode is driven
Solution Approach 1:
A heat diffusion layer made of high thermal conductivity material (such as metal) is introduced as an intermediary between the IDT electrodes and the piezoelectric substrate. This heat diffusion layer acts as a thermal mediator that efficiently conducts heat away from the IDT electrodes through the substrate and terminals, significantly improving heat dissipation while maintaining the elastic wave filtering function
Solution Approach 2:
The patent employs composite material structure by combining the piezoelectric substrate with a heat diffusion layer made of high thermal conductivity material. This composite structure integrates both the piezoelectric properties needed for elastic wave filtering and the thermal conductivity properties needed for effective heat dissipation, resolving the contradiction between filtering performance and heat management
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly improves heat dissipation, maintaining attenuation characteristics and preventing deterioration of out-of-band attenuation, while reducing electrical interference and effectively managing heat generated by the IDT electrodes.
Implementation Method 1
Incorporating a heat diffusion layer made of high thermal conductivity material, such as metal, on the piezoelectric substrate that overlaps the IDT electrodes
Implementation Method 2
connected via plating films, which enhances heat dissipation by diffusing heat away from the IDT electrodes through the substrate and terminals
Data Source
AI summary
An elastic wave filter apparatus includes at least one excitation electrode, a first electrode land, and second electrode lands provided on a first main surface of a device substrate including a piezoelectric layer. A signal terminal and metal members are provided on a second main surface of the device substrate. The first electrode land and the signal terminal are connected to a signal potential, and the second electrode lands and the metal members are connected to a ground potential. A first connection electrode connects the first electrode land and the signal terminal, and a second connection electrode connects at least one of the second electrode lands and at least one of the metal members. The at least one metal member connected to the second connection electrode overlaps at least a portion of the at least one excitation electrode across the device substrate.