Elastic Wave Filter Layout for Heat Dissipation and Noise Shielding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Elastic wave devices face issues with heat dissipation and electrical characteristic deterioration due to heat generation and noise interference, particularly in devices with multiple functional electrodes where heat dissipation is insufficient and noise affects the performance of reception filters more significantly than transmission filters.
Innovation Solution
The implementation of a high-thermal-conductivity conductor layer separated into regions corresponding to transmission and reception functional electrodes, connected via conductors to ground terminals, effectively dissipates heat and shields against noise, preventing electrical characteristic deterioration and breakdowns by ensuring efficient heat management and noise protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a through hole is provided in the elastic wave element for heat dissipation, then heat dissipation is improved, but electrical characteristics deteriorate due to noise interference
Solution Approach 1:
The patent divides the elastic wave element into multiple regions: a first region with through holes for heat dissipation, and a second region without through holes for maintaining electrical characteristics. This spatial segmentation allows simultaneous heat dissipation and noise protection by isolating the functional electrode from external noise while maintaining thermal pathways.
2Power
If large power is applied to the elastic wave device, then output power is improved, but heat generation increases causing efficiency decrease and potential breakdown
Solution Approach 1:
The patent introduces a resin layer as an intermediary substance filling the through holes. This resin layer serves dual functions: it maintains the thermal conduction pathway for heat dissipation while simultaneously providing electrical insulation and shielding to prevent noise interference, thereby enabling stable high-power operation.
3Temperature
If through holes are left open in the elastic wave element, then heat dissipation is maximized, but moisture enters causing functional electrode corrosion and breakdown
Solution Approach 1:
The patent applies different properties to different parts of the through holes: the walls of the through holes are treated to maintain thermal conduction, while the resin layer filling the holes provides moisture barrier properties. This local differentiation allows the structure to simultaneously achieve heat dissipation and moisture protection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces heat-related electrical characteristic deterioration and noise interference, enhancing the reliability and performance of elastic wave devices by ensuring effective heat dissipation and shielding, thereby preventing breakdowns and maintaining stable filter performance.
Implementation Method 1
a high-thermal-conductivity conductor layer having a higher thermal conductivity than the piezoelectric substrate is provided on another main surface of the piezoelectric substrate
Implementation Method 2
the high-thermal-conductivity conductor layer and the ground terminal are connected to each other via the conductor via
Data Source
AI summary
An elastic wave device includes a substrate, an elastic wave element, and an exterior resin layer. The substrate includes an outer electrode on one main surface thereof and a first mounting electrode on another main surface thereof. The elastic wave element includes a piezoelectric substrate, a transmission functional electrode, a reception functional electrode, and ground terminals on one main surface of the piezoelectric substrate, and the ground terminals are connected to the first mounting electrode. High-thermal-conductivity conductor layers are provided on another main surface of the piezoelectric substrate, conductor vias penetrate between both main surfaces of the piezoelectric substrate, and the high-thermal-conductivity conductor layers and the ground terminals are connected to each other by the conductor vias.