Elastic Wave Resonator Layout for IDT Heat Dissipation
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Solution Overview
Problem
Elastic wave devices face heat dissipation challenges due to increased electrical power demands, leading to potential melting of IDT electrode portions and deterioration of resonator characteristics, especially when using dielectric protective films with low thermal conductivity.
Innovation Solution
Incorporating a heat-conductive material layer with insulating properties, positioned strategically to exclude regions above IDT electrode fingers and mount electrodes, which connects to the wiring electrodes and mount electrodes, enhancing heat dissipation while minimizing impact on resonator characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the film thickness of the protective film on the IDT electrode is increased to dissipate heat, then heat dissipation performance is improved, but resonator characteristics deteriorate
Solution Approach 1:
The heat dissipation function is segmented from the protective film by introducing a separate heat-conductive material layer. This layer is positioned in regions excluding the excitation region of the IDT electrode and the region above the mount electrode, allowing heat dissipation without interfering with resonator characteristics.
Solution Approach 2:
The heat-conductive material layer is strategically positioned only in specific regions (excluding the excitation region and mount electrode region) rather than uniformly across the entire device. This localized approach provides heat dissipation where needed while preserving resonator characteristics in critical areas.
2Speed
If electrical power applied to the filter is increased to meet high-speed communication demands, then communication speed is improved, but IDT electrode portion generates heat and melts
Solution Approach 1:
The heat-conductive material layer acts as an intermediary between the IDT electrode and the surrounding environment. It provides a dedicated heat dissipation pathway that allows high power operation without direct thermal damage to the IDT electrode, enabling high-speed communication while managing heat generation.
3Temperature
If a protective film made of dielectric material with high thermal conductivity is formed on the IDT electrode portion, then heat dissipation is improved, but device complexity increases
Solution Approach 1:
The heat dissipation function is extracted from the protective film by introducing a separate heat-conductive material layer. This separation allows the protective film to maintain its primary protective function while the dedicated heat-conductive layer handles thermal management, reducing the complexity requirements for the protective film itself.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides high heat-dissipation performance with reduced risk of electrical characteristic deterioration, effectively managing heat generated by IDT electrodes and maintaining resonator performance even under increased power conditions.
Implementation Method 1
a heat-conductive material layer having an insulating property and defined at least partially by a region excluding an excitation region of an interdigital transducer (IDT) electrode and a region located above a mount electrode
Data Source
AI summary
An elastic wave device includes a piezoelectric substrate, an IDT electrode on the piezoelectric substrate and including first and second busbars and first and second electrode fingers connected to the first and second busbars, a bump electrode electrically connected to the IDT electrode, a protective film covering the IDT electrode, and a heat-conductive material layer that has an insulating property and that is provided only in a region excluding an excitation region of any IDT electrode and a region located above the bump electrode.