Elastic Wave Module Resin Sealing With Preserved Air Gap
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Solution Overview
Problem
The existing packaging methods for electronic devices like Power Amplifier Modules (PAMiD) require different resins for SAW filter and other chips, leading to increased costs and complexity due to the need for separate resin sealing methods.
Innovation Solution
A module design using a single material resin that covers the elastic wave device while leaving an air gap between the package substrate and the functional element, and fills the space between the substrate and semiconductor devices, with the resin being photocurable and thermocurable to reduce material and process costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If different resins are used for SAW filter and other chips, then sealing performance is improved, but manufacturing cost and process complexity increase
Solution Approach 1:
The patent combines multiple resin functions into a single resin material. The resin simultaneously provides sealing for SAW filters (by leaving air gaps), filling for other chips, heat dissipation, and electromagnetic shielding. This merging eliminates the need for separate resin applications and reduces process complexity while maintaining comprehensive sealing performance.
Solution Approach 2:
The resin is designed to perform multiple functions universally across different component types. A single resin formulation serves as both sealing resin for SAW filters and filling resin for other chips, while also providing heat dissipation and electromagnetic shielding. This multi-functionality resolves the contradiction by eliminating specialized resin requirements.
2Reliability
If different resins are used for SAW filter and other chips, then sealing performance is improved, but material cost increases
Solution Approach 1:
The patent merges multiple resin materials into a single resin system, eliminating the need to purchase, store, and apply multiple specialized resins. The single resin provides sealing, filling, heat dissipation, and electromagnetic shielding functions, reducing material costs while maintaining comprehensive sealing performance through its multi-functional design.
Solution Approach 2:
The resin achieves universal application across all component types (SAW filters, power amplifiers, switches), eliminating the need for component-specific resin selection. This universality reduces material costs by standardizing the resin bill of materials while maintaining appropriate sealing and protective functions for each component type.
3Volume of moving object
If all chips are mounted in bare chip form, then miniaturization and thinning are achieved, but resin sealing complexity increases
Solution Approach 1:
The patent combines sealing and filling operations into a single resin application process. By using one resin that performs both functions simultaneously, the module achieves miniaturization and thinning through bare chip mounting while avoiding the increased complexity that would result from separate sealing and filling operations.
Solution Approach 2:
The resin provides universal coverage for all bare chips mounted on the module, performing both sealing (for SAW filters) and filling (for other chips) in a single operation. This multi-functionality enables miniaturization and thinning while maintaining simplified resin sealing processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces material costs and simplifies the manufacturing process by using a single resin for all components, while maintaining the air gap for improved heat dissipation and electromagnetic shielding, making the module more cost-effective.
Implementation Method 1
the resin being photocurable and thermocurable
Implementation Method 2
the resin being photocurable and thermocurable
Data Source
AI summary
A module includes a package substrate, an elastic wave device mounted on the package substrate, the elastic wave device includes a first main surface having a functional element, the first main surface faces the package substrate, a semiconductor device mounted on the package substrate, and a resin made from a single material, the resin covers the elastic wave device while leaving an air gap between the package substrate and the functional element, and the resin covers the semiconductor device while filling a space between the package substrate and the semiconductor device.