Elastic Wave Wafer Singulation With Resin-Layer Edge Protection
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Solution Overview
Problem
Existing methods for manufacturing surface acoustic wave devices using piezoelectric wafers often result in breakage or chipping during the dicing process due to the dicing blade coming into contact with the corners of the devices.
Innovation Solution
The method involves providing a resin layer that extends across the boundaries between adjacent elastic wave devices and using a base layer with a lower elasticity modulus than the support layers, allowing for orthogonal cutting without direct contact between the dicing blade and the piezoelectric substrate, thereby reducing stress and preventing chipping.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If dicing is performed in both first and second directions to singulate the piezoelectric wafer, then individual elastic wave devices are obtained, but breakage or chipping occurs in the piezoelectric substrates at the corners
Solution Approach 1:
A resin layer is introduced as an intermediary material between the dicing blade and the piezoelectric substrate. This resin layer absorbs the mechanical stress and impact from the dicing blade, preventing direct contact damage to the piezoelectric substrate corners while still allowing effective singulation of individual devices
Solution Approach 2:
The resin layer is applied to the piezoelectric wafer before the dicing process begins. This pre-application provides cushioning protection at the corners and edges of the piezoelectric substrates, anticipating and preventing the breakage or chipping that would occur during the orthogonal dicing operations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively minimizes breakage or chipping of the piezoelectric substrates during the cutting process, ensuring accurate singulation and reducing defects in the elastic wave devices.
Implementation Method 1
a piezoelectric wafer, wherein a plurality of interdigital transducer electrodes corresponding to a plurality of elastic wave devices are provided on a first main surface of the piezoelectric wafer
Data Source
AI summary
An elastic wave device manufacturing method includes a preparing a piezoelectric wafer on which IDT electrodes are provided in elastic wave device forming portions, providing on a first main surface of the piezoelectric wafer support layers in the elastic wave device forming portions, bonding a cover member to cover the support layers to obtain a multilayer body, cutting the multilayer body in a first direction multiple times, cutting the multilayer body in a second direction orthogonal to the first direction to obtain elastic wave devices, in which a resin layer extends across a boundary between the elastic wave device forming portions adjacent to each other on the first main surface of the piezoelectric wafer, and the second cutting step is performed in a state in which the resin layer is present.