Elastic Wave Device Wiring Pattern with Partition Layer
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing elastic wave devices face challenges in achieving a high-quality wiring structure with low loss, high reliability, and durability, particularly in high-frequency applications.
Innovation Solution
The elastic wave device incorporates a wiring pattern with a first wiring layer and a second wiring layer, where the second wiring layer includes a lower metal layer, a partition layer with lower electrical conductivity, and an upper metal layer, which are electrically connected and insulated to reduce signal attenuation and enhance durability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a simple single-layer wiring structure is used, then the device complexity is reduced, but the signal loss increases and durability decreases
Solution Approach 1:
The wiring structure is segmented into multiple functional layers: a first wiring layer for primary electrical connection, a partition layer for mechanical support and electrical isolation, and a second wiring layer for enhanced conductivity. This segmentation allows each layer to perform its specific function optimally, reducing overall signal loss while maintaining manageable complexity through clear functional division.
Solution Approach 2:
The wiring structure employs composite material design by combining different metal materials in the first wiring layer, partition layer, and second wiring layer. Each layer uses materials selected for their specific properties (conductivity, mechanical strength, adhesion), creating a composite structure that achieves superior electrical and mechanical performance compared to single-material designs.
2Reliability
If a multi-layer wiring structure with partition layer is used, then the durability and reliability are improved, but the manufacturing complexity increases
Solution Approach 1:
The partition layer is formed preliminarily between the first and second wiring layers during the manufacturing process. This preliminary action of creating the partition structure early in the process sequence provides a stable foundation for subsequent wiring layer formation, ensuring proper electrical isolation and mechanical support are established before final wiring connections are made, thereby improving reliability while streamlining the overall manufacturing flow.
3Reliability
If the partition layer has high electrical conductivity, then the electrical connection is improved, but the signal attenuation increases
Solution Approach 1:
The partition layer is designed with local quality by selectively controlling its electrical conductivity properties. The partition layer provides sufficient electrical isolation in regions where signal attenuation must be minimized, while maintaining adequate electrical connection reliability in regions where mechanical support and structural stability are critical. This localized property optimization allows the structure to simultaneously achieve both goals in different spatial zones.
Data Source
AI summary
An elastic wave device includes a wiring board, a device chip having a resonator, and a wiring pattern electrically connected to the resonator, the device chip is electrically connected to the wiring board, and a sealing portion that seals the device chip. The wiring pattern includes a first wiring layer and a second wiring layer. The second wiring layer includes a lower metal layer in contact with an upper surface of the first wiring layer, a partition layer which is a metal layer in contact with an upper surface of the lower metal layer, and an upper metal layer in contact with an upper surface of the partition layer. The partition layer is a metal having a lower electrical conductivity than the lower metal layer and the upper metal layer.