Solvent-Free Elastomer Adhesive for ESP Cable Insulation
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Solution Overview
Problem
Existing ESP cable manufacturing techniques using liquid-based adhesives face issues with incomplete drying leading to void formation, over-drying reducing adhesiveness, thermal degradation of adhesives at high temperatures, and environmental concerns from volatile organic compounds, resulting in compromised bonding and premature cable failure.
Innovation Solution
The development of elastomer-based adhesive compositions comprising polyolefin polymers with anhydride groups, adhesion promoting agents like polybutadiene polymers, antioxidants, and curative agents, which are applied via extrusion and vulcanized to create strong, gas-blocking bonds between conductors and insulation layers, eliminating the need for a drying step and enhancing thermal stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If liquid-based adhesives are used for bonding conductor and insulation layers, then ease of application is improved, but void formation and bonding reliability deteriorate due to incomplete drying
Solution Approach 1:
The patent changes the fundamental parameter of adhesive composition from liquid-based to solvent-free elastomer-based formulation. This eliminates the drying process entirely while maintaining ease of application through direct extrusion and bonding capabilities, thereby resolving the contradiction between ease of application and bonding reliability.
Solution Approach 2:
The invention extracts and removes the solvent component from the adhesive system entirely. By eliminating the solvent, the drying step is removed from the process, preventing void formation while preserving the adhesive's applicability through alternative bonding mechanisms.
2Ease of operation
If liquid-based adhesives are used for bonding, then ease of application is improved, but bonding strength deteriorates due to over-drying reducing adhesiveness
Solution Approach 1:
The patent fundamentally changes the adhesive parameter from liquid to solid elastomer form, eliminating the drying process that causes over-drying and loss of adhesiveness. The solvent-free formulation maintains optimal bonding strength while preserving ease of application through direct extrusion methods.
3Ease of manufacture
If conventional adhesives are used in high temperature environments, then initial bonding is achieved, but bonding reliability deteriorates due to thermal degradation
Solution Approach 1:
The invention changes the material composition parameter from conventional adhesive to elastomer-based formulation with specific thermal stability characteristics. This enables the adhesive to maintain bonding reliability in high temperature downhole environments while preserving initial bonding capability during manufacturing.
Solution Approach 2:
The patent employs composite material formulation combining elastomers with specific functional additives that provide both initial bonding capability and long-term thermal stability. This composite approach resolves the contradiction between achieving initial bond and maintaining reliability under thermal stress.
4Ease of operation
If solvent-based adhesives are used, then ease of application is improved, but environmental harm increases due to volatile organic compounds
Solution Approach 1:
The invention extracts and eliminates the solvent component (volatile organic compounds) from the adhesive system. This removal eliminates environmental harm while preserving ease of application through the solvent-free elastomer formulation that can be directly applied via extrusion.
Solution Approach 2:
The patent changes the compositional parameter from solvent-based to solvent-free formulation. This parameter change eliminates harmful volatile organic compounds while maintaining the adhesive's applicability through alternative delivery and bonding mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The new adhesive compositions provide enhanced bonding integrity, resistance to thermal degradation, and improved durability, reducing the risk of cable failure and environmental impact by preventing gas migration and corrosion, while allowing for reuse of ESP cables.
Implementation Method 1
an adhesive layer bonding the insulation layer to the conductor wire
Implementation Method 2
vulcanized to create strong, gas-blocking bonds
Implementation Method 3
0.1 ∼5 parts by weight of an antioxidant
Implementation Method 4
applied via extrusion
Data Source
AI summary
An adhesive composition includes 100 parts by weight of a polyolefin polymer derived from an olefin monomer copolymerized with at least one co-monomer that is different form the olefin monomer; 1˜100 parts by weight of an adhesion promoting agent comprising a polybutadiene polymer, which has a molecular weight of 1,000˜10,000 and has an anhydride group grafted thereon; 0.1˜5 parts by weight of an antioxidant; and 0.5˜15 parts by weight of a curative agent. An adhesive composition includes 100 parts by weight of a polyolefin polymer derived from an olefin monomer copolymerized with at least one co-monomer that is different form the olefin monomer, where in the polyolefin polymer comprises an anhydride group grafted thereon; 0.1˜5 parts by weight of an antioxidant; and 0.5˜15 parts by weight of a curative agent.