Elastomer Bonding Member Embeds Support Posts in Fluid Chip
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Solution Overview
Problem
Current microfluid device manufacturing methods face challenges such as high manufacturing costs, low productivity, and ununiformity in microflow passage dimensions due to adhesive issues and heat sealing, which affect the precision and functionality of the devices.
Innovation Solution
A fluid chip with a novel structure featuring a base and a bonding member formed from elastomer resin, where support post portions on the base are embedded in the bonding member, allowing for self-adhesive bonding without adhesives and ensuring uniform flow passage dimensions through mechanical fixation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If adhesive bonding methods are used to join microfluid device components, then assembly is simplified, but manufacturing precision and uniformity of microflow passage dimensions deteriorate due to adhesive variability
Solution Approach 1:
The invention extracts and eliminates the adhesive from the bonding process. Instead of using adhesive to join the cap to the base, the invention uses direct thermal fusion bonding, removing the source of dimensional variability while maintaining assembly feasibility through heat-induced material fusion.
Solution Approach 2:
The invention replaces the chemical bonding mechanism (adhesive) with a thermal-mechanical bonding mechanism (thermal fusion). The heating unit applies controlled heat to fuse the cap and base materials directly, substituting chemical adhesion with thermal-mechanical fusion to achieve precise dimensional control.
2Ease of manufacture
If heat sealing methods are used to bond microfluid device components, then assembly is achieved, but manufacturing precision deteriorates due to heat-induced deformation and ununiformity in microflow passage dimensions
Solution Approach 1:
The invention changes the thermal parameters of the bonding process by using controlled, localized heating through a heating unit rather than bulk heat sealing. This allows precise temperature control during bonding, preventing heat-induced deformation while maintaining bonding effectiveness, thus preserving microflow passage dimensional consistency.
Solution Approach 2:
The invention performs preliminary positioning and fixation of the cap and base components before applying heat for bonding. This preliminary arrangement ensures correct alignment is established prior to thermal processing, preventing deformation and ensuring uniform microflow passage dimensions are maintained throughout the bonding process.
3Productivity
If conventional manufacturing methods are used, then production can proceed, but productivity remains low and manufacturing costs remain high
Solution Approach 1:
The invention merges multiple manufacturing steps into an integrated molding process. The cap and base are formed in a single molding operation with built-in bonding features, eliminating separate bonding steps and reducing manufacturing complexity. This integration improves productivity while controlling costs through process consolidation.
Solution Approach 2:
The invention discards traditional multi-step manufacturing approaches involving separate component fabrication and bonding. By using integrated molding with thermal fusion bonding, the process recovers manufacturing efficiency and reduces costs by eliminating intermediate steps, adhesives, and complex assembly operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing costs, enhances design flexibility, and improves the precision and functionality of microfluid devices by maintaining constant flow passage dimensions and eliminating adhesive-related issues, enabling more precise experiments and measurements.
Implementation Method 1
a bonding member formed from an elastomer resin and having an upper end surface provided at a position higher than the top surface of the base; the base has support post portions projecting to higher than the top surface and demarcating a height of side surfaces of the flow passage, and the support post portions of the base are embedded in the bonding member
Data Source
AI summary
A fluid chip suitable for a fluid device is disclosed in which an upper surface of a flow passage has another member bonded thereto. The disclosed fluid chip, in which a flow passage is formed, comprises a base material having a top surface forming at least a portion of a bottom surface of a flow passage, and a bonding member which is formed from an elastomer resin and an upper end surface of which is provided in a position higher than the top surface of the base material. The base material has a support post portion which projects from the top surface and defines the height of a side surface of the flow passage, and the support post portion of the base material is embedded in the bonding member.