Thermally Conductive Elastomer Mounting for Camera Light Source Heat Dissipation
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Solution Overview
Problem
Conventional camera light sources in electronic devices face challenges in compactness, heat dissipation, and shock resistance, leading to potential damage from overheating and mechanical stress during operation.
Innovation Solution
The use of thermally conducting elastomeric structures with metal brackets and screws to mount camera light sources within a metal housing, providing shock resistance and efficient heat dissipation by aligning insert structures with the housing and using thermally conductive materials to direct heat away from the component.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If camera light sources are operated continuously to provide illumination, then illumination reliability is improved, but heat generation increases causing overheating damage
Solution Approach 1:
A thermally conductive elastomeric material is introduced as an intermediary between the light source and the housing. This material has high thermal conductivity to efficiently conduct heat away from the light source, while also providing mechanical compliance and shock absorption. The elastomeric material acts as a thermal mediator that transfers heat from the light source through the housing wall to the external environment.
Solution Approach 2:
The patent changes the thermal conductivity parameter of the mounting structure by using a thermally conductive elastomeric material instead of conventional non-conductive materials. This parameter change enables efficient heat transfer while maintaining the mechanical properties needed for shock resistance and compact mounting.
2Ease of manufacture
If conventional mounting structures are used on flexible printed circuits, then ease of installation is improved, but heat dissipation efficiency deteriorates
Solution Approach 1:
The elastomeric material serves as a thermal intermediary that bridges the light source and the metal housing. This mediator provides both mechanical mounting functionality and superior thermal conduction compared to conventional flexible circuit board mounting, resolving the trade-off between ease of installation and heat dissipation efficiency.
3Volume of moving object
If compact mounting is implemented to reduce device size, then device compactness is improved, but shock resistance deteriorates
Solution Approach 1:
The elastomeric material changes the mechanical parameter of the mounting structure by providing compliance and shock absorption while maintaining compact dimensions. This material allows the light source to be firmly yet flexibly mounted in a compact space, resisting shocks and drops that would damage rigidly mounted components.
4Loss of energy
If thermally conductive materials are used to improve heat dissipation, then heat dissipation efficiency is improved, but device complexity increases
Solution Approach 1:
The elastomeric material performs multiple functions simultaneously: it provides thermal conduction, mechanical compliance, shock absorption, and electrical insulation. This multi-functionality eliminates the need for separate components for each function, thereby improving heat dissipation without increasing device complexity.
Solution Approach 2:
The patent merges the functions of thermal management and mechanical mounting into a single elastomeric component. This consolidation combines heat dissipation, shock resistance, and mounting into one element, simplifying the overall structure while achieving superior thermal performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively dissipates heat and provides shock resistance, protecting the electronic components from damage due to overheating and mechanical stress, while maintaining a compact form factor.
Implementation Method 1
Heat may be conducted away from the electronic component and into the housing the thermally conducting elastomeric structures, the metal bracket, the screws, and the support structures.
Data Source
AI summary
An electronic device may be provided with an electronic component such as a camera light source containing a light-emitting diode. During operation, the light-emitting diode may produce heat. Thermally conducting elastomeric structures may have features such as sidewalls that mate with external surface of the camera light source or other electronic component to dissipate heat from the electronic component. Metal structures such as a bracket may be used to press the elastomeric structures and the electronic component towards a wall of a housing for the electronic device. Support structures may be interposed between the wall of the housing and the elastomeric structures. The support structures may have an opening that is aligned with an opening in the housing wall. Insert structures may be received within the opening in the support structures. The electronic component may be aligned with the insert structures and the opening in the support structures.