Elastomer-Damped Electronic Housing for Vibration Resistance
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Electronic components in vibration-prone environments, such as the automotive sector, face issues with vibration-induced resonance problems due to the transmission of disruptive vibrations through stiff casting compounds, leading to functional and reliability issues at the connection points.
Innovation Solution
A device for vibration-proof housing of electronic components using a fiber-reinforced, injection-molded carrier element with a cavity, a thermoplastic elastomer damping layer, and a filling compound, where the damping layer is applied directly to the carrier element and between the electronic component and the carrier element, providing a thickness of at least 100 μm to absorb vibrations and ensure adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a rigid potting compound is used to encapsulate the electronic component, then permanent mounting and IP 67 sealing are achieved, but vibration-induced resonance problems and transmission of disruptive vibrations occur
Solution Approach 1:
A damping layer made of thermoplastic elastomer is introduced as an intermediary between the rigid potting compound and the electronic component. This intermediate layer absorbs vibrations and prevents them from being transmitted to the component, while the rigid potting compound maintains its sealing and mounting functions.
Solution Approach 2:
The solution uses a composite structure combining a rigid potting compound for sealing with a flexible thermoplastic elastomer damping layer for vibration absorption. This composite material approach allows both permanent mounting/IP 67 sealing and vibration protection to coexist.
2Object-affected harmful factors
If the damping layer thickness is increased to improve vibration absorption, then vibration protection improves, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
The damping layer thickness is optimized to a specific range (0.5-5 mm, preferably 1-3 mm) to achieve effective vibration absorption without excessive complexity. This parameter optimization balances vibration protection with manufacturability and device simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces the risk of vibration-induced fractures and long-term reliability issues, maintaining consistent electrical connection quality and achieving IP 67 sealing, with improved mechanical switching thresholds and reduced oxidation cracking.
Implementation Method 1
a damping layer, which is applied directly to the carrier element and is arranged at least partially between the electronic component and the carrier element. The damping layer comprises a thermoplastic elastomer material
Implementation Method 2
The damping layer comprises a thermoplastic elastomer material
Implementation Method 3
a filling compound that adheres to the damping layer and the electronic component and is arranged between the electronic component and the carrier element
Data Source
Figure 1~2
Figure 3~5
AI summary
The present invention relates to a device (100) for the vibration-proof housing of an electronic component (110). The device (100) comprises a fibre-reinforced, injection-moulded carrier element (101) which has a cavity for accommodating the electronic component (110). The device (100) also comprises the electronic component (110), which is arranged in the cavity, and a damping layer (103) which is applied directly to the carrier element (101) and is arranged at least in regions between the electronic component (110) and the carrier element (101), wherein the damping layer (103) has a material made of a thermoplastic elastomer and a thickness of at least 100 µm between the electronic component (110) and the carrier element (101). The device also has a filling mass (102) which adheres to the damping layer (103) and the electronic component (110) and which is arranged between the electronic component (110) and the carrier element (101). An electrical conductor is also provided which is coupled to the electronic component (110) and the carrier element (101) and is surrounded by the damping layer (103) at least in regions.