Elastomer-Modified CMP Pad for Planarization
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Solution Overview
Problem
Current polishing pads for semiconductor and magnetic substrates face challenges in achieving superior planarization, defectivity, high removal rates, short break-in times, and stable performance at varying temperatures, while also requiring improved manufacturability and consistency.
Innovation Solution
A chemical mechanical polishing pad is developed with a polymeric matrix incorporating an elastomeric polymer that has a glass transition temperature below room temperature, dispersed within a polymeric matrix with a glass transition temperature above room temperature, allowing for increased diamond conditioner cut rates and reduced break-in time through controlled phase separation and domain size manipulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If polymeric microballoons are used in the polishing pad, then planarization capability is improved, but the microballoons are difficult to disperse uniformly and have broad particle size distribution
Solution Approach 1:
The patent changes the physical state parameter of the elastomeric polymer from solid particles to liquid form at room temperature. This parameter change enables uniform dispersion throughout the polymeric matrix while maintaining the desired particle size distribution after curing, resolving the contradiction between planarization capability and dispersion uniformity.
2Temperature
If hard segments are increased to control dimensional thermal stability, then strength and stiffness at elevated temperatures are improved, but flexibility and toughness are reduced
Solution Approach 1:
The patent creates a composite material system with two distinct phases: hard segments for thermal stability and an elastomeric polymer phase for flexibility. This composite structure allows both hard and soft properties to coexist, resolving the contradiction between thermal stability and flexibility by combining materials with complementary properties.
3Productivity
If the polishing pad is designed for high removal rates, then productivity is improved, but defectivity increases such as scratching
Solution Approach 1:
The patent applies local quality by creating distinct phases within the polishing pad: hard segments in specific locations provide scratching resistance, while the elastomeric polymer domains provide flexibility for high removal rates. This spatial distribution of different properties resolves the contradiction between productivity and defectivity.
4Stability of the object's composition
If the polymeric matrix glass transition is above room temperature for stability, then dimensional stability is improved, but the pad requires longer break-in time
Solution Approach 1:
The patent performs preliminary action by incorporating the elastomeric polymer into the matrix structure before use. This pre-incorporation ensures that the flexible domains are already positioned and distributed, eliminating the need for extended break-in time while maintaining dimensional stability from the outset.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances polishing pad performance by increasing cut-rate, reducing break-in time, and maintaining stability over a wide temperature range, while providing improved defectivity and topographical control, thus addressing the limitations of existing pads.
Implementation Method 1
Phase separation increases with increasing chain length and decreasing polarity of the soft segment due to less hard segment/soft segment interaction
Implementation Method 2
The mobility of molecular chains in the soft segment, which depends on their chemical nature and chain length, results in increased flexibility, toughness and impact resistance
Implementation Method 3
Hard segments act as pseudo cross-links and control the dimensional thermal stability of polyurethanes
Implementation Method 4
a polishing pad in combination with a polishing solution, such as an abrasive-containing polishing slurry or an abrasive-free reactive liquid, removes excess material
Data Source
AI summary
The chemical mechanical polishing pad is suitable for polishing at least one of semiconductor, optical and magnetic substrates. The polishing pad includes a polymeric matrix with an elastomeric polymer distributed within the polymeric matrix. The polymeric matrix has a glass transition above room temperature; and the elastomeric polymer has an average length of at least 0.1 μm in at least one direction, represents 1 to 45 volume percent of polishing pad and has a glass transition temperature below room temperature. The polishing pad has an increased diamond conditioner cut rate in comparison to a polishing pad formed from the polymeric matrix without the elastomeric polymer.