Elastomer Strut Package Structure for Substrate Protection
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Solution Overview
Problem
Conventional package structures using rigid struts to press substrates in electronic devices face challenges such as potential damage to substrates and components, and precise machining requirements, making fabrication difficult and prone to errors.
Innovation Solution
Incorporating an elastomer with an elastic modulus lower than 1000 MPa between the strut and substrate to receive and transmit pressure, reducing the risk of damage and simplifying the fabrication process by eliminating the need for precise strut machining.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If rigid struts are used to press the substrate, then the substrate can maintain flat state and heat dissipation efficiency is enhanced, but the substrate or components may be damaged and precise machining is required
Solution Approach 1:
An elastomer is introduced as an intermediary between the rigid strut and the substrate. The elastomer receives pressure from the strut and transmits it to the substrate, serving as a protective mediator that prevents direct contact between the rigid strut and fragile components like bonding wires and electronic components, thereby eliminating damage while maintaining substrate flatness
Solution Approach 2:
The patent changes the physical parameter of the pressing element from rigid (high elastic modulus) to elastomeric (low elastic modulus). This parameter change allows the pressing element to deform elastically under load, distributing pressure more uniformly and preventing concentration of stress that could damage the substrate or components
2Stability of the object's composition
If rigid struts are used to press the substrate, then the substrate can maintain flat state, but precise machining of the strut is required making fabrication difficult
Solution Approach 1:
The patent changes the material parameter from rigid to elastomeric, which fundamentally alters the manufacturing requirements. Elastomers can be formed through molding or extrusion processes rather than precision machining, significantly reducing manufacturing precision requirements and simplifying fabrication of the pressing element
Solution Approach 2:
The patent employs an elastomeric pressing element that can be manufactured as a flexible component through forming processes. This approach replaces the need for precision-machined rigid struts with elastomeric elements that achieve the required function through material flexibility rather than geometric precision
3Force
If rigid struts contact bonding wires or electronic components to press the substrate, then the substrate can be pressed, but the bonding wires or electronic components may be damaged
Solution Approach 1:
The elastomer serves as a protective intermediary that transmits the pressing force to the substrate while preventing direct contact between the rigid strut and fragile components. The elastomer's compliance allows it to deform and distribute the force, protecting bonding wires and electronic components from damage while maintaining the necessary pressing force on the substrate
4Object-affected harmful factors
If elastomer with lower elastic modulus is used between strut and substrate, then the risk of damaging substrate and components is minimized and fabrication is easier, but pressure transmission efficiency may be reduced
Solution Approach 1:
The patent optimizes the elastomer's elastic modulus parameter to balance compliance and pressure transmission. The elastomer is designed with sufficient elasticity to prevent damage to components while maintaining adequate stiffness to efficiently transmit pressure from the strut to the substrate, resolving the trade-off between protection and transmission efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The elastomer minimizes the risk of damaging substrates and components while allowing for easier fabrication, enhancing pressure distribution and heat dissipation efficiency, and increasing the density of electronic components.
Implementation Method 1
The elastomer is arranged between the corresponding strut and the substrate, and configured for receiving a pressure from the corresponding strut and transmitting the pressure to the substrate
Data Source
AI summary
A package structure includes a substrate, at least one electronic component, a housing and at least one strut. The at least one electronic component is disposed on a first surface of the substrate. The housing covers the first surface of the substrate. The housing has an accommodation space. The at least one electronic component is accommodated within the accommodation space. The at least one strut is protruded from an inner surface of the housing and extended toward the accommodation space. The at least one elastomer is arranged between the corresponding strut and the substrate.