Elastomeric Damping Mount for Heat Sink Overhang Vibration Control
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Solution Overview
Problem
Existing heat sink mounting designs struggle to effectively manage dynamic forces and vibrations experienced by overhanging portions of heat sinks during shipping and operation, which can lead to thermal degradation and damage to computing devices.
Innovation Solution
A low-force secondary heat sink mounting assembly using elastomeric damping elements to absorb and dissipate dynamic forces, augmenting primary mounts and providing support to overhanging portions of heat sinks without applying static loads, thus controlling vibrations and shock loads.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If rigid attachments are used to support the ends of the heat sink, then the heat sink is more stable, but significant forces are transmitted to the CPU or support structure due to the lever effect of the overhanging portion
Solution Approach 1:
The patent changes the mechanical parameter of the mounting attachment from rigid to compliant by using elastomeric material. This compliant material absorbs dynamic forces and reduces the lever effect transmitted to the CPU, resolving the contradiction between heat sink stability and force transmission.
Solution Approach 2:
The elastomeric material acts as an intermediary between the heat sink and the support structure. It provides a compliant interface that supports the overhanging portion while absorbing dynamic forces, preventing direct force transmission to the CPU or rigid support structure.
2Device complexity
If the heat sink is mounted in a cantilevered manner, then the design is simpler, but shock and vibration loading are not well controlled
Solution Approach 1:
The patent modifies the mounting system by adding compliant elastomeric attachments at the ends of the heat sink. This increases the complexity slightly but dramatically improves shock and vibration control by allowing the ends to move independently and absorb dynamic loading.
Solution Approach 2:
The mounting system is segmented into multiple independent attachment points: a primary mount near the CPU and secondary compliant mounts at the ends. This segmentation allows each mount to independently handle different aspects of loading, improving overall reliability without excessive complexity.
3Manufacturing precision
If springs are provided in the primary mount to control dynamic forces, then tolerances are accommodated, but other points of contact with the heat sink must be avoided to prevent compromising spring operation
Solution Approach 1:
The mounting system is divided into primary spring-based mounts near the CPU and secondary elastomeric mounts at the ends. This segmentation allows the springs to handle dynamic forces and tolerances at the primary location without interference from additional contact points, while the elastomeric ends provide independent support.
Solution Approach 2:
The elastomeric material serves as an intermediary support that eliminates the need for additional rigid contact points. It provides a compliant interface that accommodates tolerances and dynamic forces without interfering with the spring operation at the primary mount location.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces the risk of damage to heat sinks and CPUs by absorbing dynamic forces, enhancing the reliability of computing devices and allowing for greater manufacturing tolerances without compromising thermal interface performance.
Implementation Method 1
A low-force secondary heat sink mounting assembly using elastomeric damping elements to absorb and dissipate dynamic forces
Implementation Method 2
controlling vibrations and shock loads
Data Source
AI summary
A computer adapted for force-air cooling of a processor. The computer includes a board supporting the processor and a heat sink mounted such with its base plate contacting the processor. A primary mount supports the heat sink near the processor, and a portion of the heat sink base plate extends outward a distance or overhang length from the primary mount to an edge. The apparatus includes a secondary heat sink mounting assembly supported upon the processor board that includes a damping element with an resilient body positioned proximate to the edge of the base plate, whereby the body abuts the base plate during movement of the base plate toward the board, e.g., upon application of a dynamic or shock load that causes the overhanging portions of the base plate of the heat sink to vibrate or oscillate about the support locations of the primary mount.