Elastomeric Glue for Inkjet Printhead Sealing

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Solution Overview

Problem

Existing inkjet printheads face challenges with adhesion and sealing due to the use of monocomponent epoxy-based glues, which fail under solvent-based inks, leading to electrical failures and mechanical stress issues, particularly due to low flexibility and chemical resistance limitations.

Innovation Solution

A novel elastomeric glue is developed using linear, unsaturated hydrocarbon-based polymers with polyisoprene graft maleic anhydride and polybutadiene-styrene, sulfur donor molecules, and an organometallic zinc catalyst, which undergoes vulcanization to form polysulfidic bridges, providing high adhesion, flexibility, and chemical resistance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If monocomponent epoxy-based glue is used for bonding chip to cartridge body, then adhesion is achieved, but chemical resistance to solvent-based inks deteriorates

Engineering Contradiction:
ImproveadhesionVSAvoidchemical resistance
Core Design Contradiction:
StrengthVSReliability

Solution Approach 1:

The patent changes the chemical composition parameters of the glue from epoxy-based to polysulfidic bridge-based elastomeric material. This fundamental parameter change in the chemical structure enables the glue to resist solvent-based inks while maintaining adhesion properties, directly resolving the contradiction between adhesion strength and chemical resistance

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The invention uses a composite elastomeric material containing polysulfidic bridges between polymer units. This composite structure combines the flexibility and adhesion of elastomers with the chemical resistance of sulfur-crosslinked networks, achieving both strong bonding and resistance to solvent-based inks simultaneously

Inventive Principle:
Principle #40Composite materials

2Strength

If monocomponent epoxy-based glue is used for bonding, then bonding strength is achieved, but flexibility deteriorates leading to thermal stress damage

Engineering Contradiction:
Improvebonding strengthVSAvoidflexibility
Core Design Contradiction:
StrengthVSAdaptability or versatility

Solution Approach 1:

The patent changes the physical state parameters of the glue from rigid epoxy to flexible elastomeric material with polysulfidic crosslinks. This parameter change in material properties provides both adequate bonding strength and the necessary flexibility to absorb thermal stresses during manufacturing and shelf life, preventing damage to silicon chip parts

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The invention employs an elastomeric glue layer that acts as a flexible bonding interface between the chip and cartridge body. This flexible layer can deform and absorb thermal expansion differences, preventing stress concentration and potential failure of the brittle silicon chip while maintaining secure bonding

Inventive Principle:
Principle #30Flexible shells and thin films

3Strength

If epoxy-based glue is used, then initial adhesion is achieved, but swelling under solvent action occurs causing electrical failures

Engineering Contradiction:
ImproveadhesionVSAvoiddimensional stability
Core Design Contradiction:
StrengthVSStability of the object's composition

Solution Approach 1:

The patent fundamentally changes the chemical composition from epoxy to polysulfidic crosslinked elastomer. This parameter change in the molecular structure provides resistance to solvent-based inks, preventing the swelling and adhesion loss that occurs with epoxy-based glues, thereby maintaining both adhesion strength and dimensional stability in solvent environments

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The elastomeric glue ensures robust bonding and sealing in inkjet printheads, resisting solvent-based inks and UV curable inks, while absorbing thermal stresses, maintaining adhesion to silicon and polyolefin surfaces, and preventing ink leakage.

Implementation Method 1

catalyzing vulcanization reaction of the one or more linear, unsaturated hydrocarbon based polymers with the sulfurized zinc complex to obtain vulcanized polymers and thiols; crosslinking the polymeric chains of the vulcanized polymers obtained in step b) via polysulfidic bridges between units

Methodology Applied
Scientific EffectVulcanization: Chemical Bonding

Implementation Method 2

an organometallic zinc catalyst, the method comprising the steps of a) reacting the one or more sulfur donor molecules with the organometallic zinc catalyst to form a sulfurized zinc complex as an active cross-linking initiator; b) catalyzing vulcanization reaction

Methodology Applied
Scientific EffectCatalysis: Catalysis

Data Source

PatentEP4232292B1Solvent resistant elastomeric GLUE for ink jet printhead
Publication Date: 2024.11.27 SICPA HOLDING SA
  • EP4232292B1 patent drawingFigure 1
  • EP4232292B1 patent drawing
  • EP4232292B1 patent drawing

AI summary

The present invention provides an elastomeric glue with a good chemical resistance against solvent based inks, and a method for preparing the elastomeric glue. The elastomeric glue is used inside of an inkjet printhead as a hydraulic glue, and capable of tightly bonding the chip to hydraulic part of the reservoir of the cartridge body and the plugs to the reservoir of the inkjet printhead. Accordingly, the inkjet printhead with the elastomeric glue of the present invention is resistant to both traditional solvent based inks and UV curable inks, and is capable of being printed on porous and not porous surfaces.