Elastomeric Composition for the Manufacture of Heat Transfer Embossing Dies

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Solution Overview

Problem

Existing elastomeric compositions for heat transfer embossing dies lack complex material properties such as high thermal conductivity, hardness, and resistance to abrasion and deformation.

Innovation Solution

An elastomeric composition comprising a polymer matrix of organosilicon rubber, thermally conductive metallic copper particles, organic carbon black particles, inorganic pyrogenic silicon dioxide, and a crosslinking agent, with specific ratios and amounts, to enhance thermal conductivity and hardness while reducing abrasion.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If thermally conductive fillers are introduced into the polymer matrix, then thermal conductivity is improved, but hardness and abrasion resistance deteriorate

Engineering Contradiction:
Improvethermal conductivityVSAvoidhardness and abrasion resistance
Core Design Contradiction:
TemperatureVSStrength

Solution Approach 1:

The patent employs a multi-component composite system combining organosilicon rubber matrix with three types of fillers: thermally conductive metallic particles (copper, aluminum), reinforcing inorganic filler (pyrogenic silicon dioxide), and organic filler (carbon black). This composite structure achieves synergistic effects where metallic particles provide thermal conductivity, silicon dioxide enhances hardness and abrasion resistance, and carbon black contributes to both reinforcement and thermal conduction, thereby resolving the contradiction between thermal conductivity and mechanical strength

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent specifies precise compositional parameters including the ratio of metallic particles to pyrogenic silicon dioxide (75:25 to 200:5 by weight), carbon black content (10-100 parts per 100 parts rubber), and vinyl group content (0.03-1.1 g/mol). These controlled parameter variations optimize the balance between thermal conductivity and mechanical properties, allowing the composition to achieve both high thermal transmission and enhanced hardness/abrasion resistance

Inventive Principle:
Principle #35Parameter changes

2Temperature

If high proportion of fillers is used to increase thermal conductivity, then thermal transmission is improved, but the elastomeric properties and flexibility deteriorate

Engineering Contradiction:
Improveheat transmission efficiencyVSAvoidelastomeric properties and flexibility
Core Design Contradiction:
TemperatureVSStability of the object's composition

Solution Approach 1:

The patent distributes different types of fillers with specific local functions throughout the polymer matrix: metallic particles are positioned for optimal thermal conduction pathways, pyrogenic silicon dioxide provides localized reinforcement at stress points, and carbon black fills interstitial spaces. This spatial distribution strategy ensures that high filler proportions enhance thermal conductivity without uniformly compromising elastomeric flexibility, as each filler type serves its specific functional niche

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent controls the total filler content and composition ratios within specific ranges: metallic particles (75-200 parts), pyrogenic silicon dioxide (5-50 parts), and carbon black (10-100 parts) per 100 parts rubber. Additionally, the vinyl group content is limited to 0.03-1.1 g/mol to maintain crosslinking balance. These parameter constraints ensure that even at high filler proportions, the elastomeric matrix retains sufficient flexibility and elastic recovery

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The composition achieves increased thermal conductivity, improved hardness, and reduced abrasion, enabling more efficient and durable heat transfer processes.

Implementation Method 1

thermally conductive filler, an inorganic reinforcing filler... thermally conductive metallic copper particles... increased thermal conductivity

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

crosslinking agent... improved hardness and increased abrasion resistance

Methodology Applied
Scientific EffectCrosslinking: Chemical Bonding

Implementation Method 3

organic reinforcing filler... carbon black particles... increased abrasion resistance

Methodology Applied
Scientific EffectFriction: Friction

Data Source

PatentUS20250243338A1Elastomeric Composition for the Manufacture of Heat Transfer Embossing Dies
Publication Date: 2025.07.31 STAMP SYSTEMS SP ZOO

AI summary

The object of the invention is an elastomeric composition for the manufacture of heat transfer embossing dies, comprising a polymer matrix in the form of an organosilicon rubber, a thermally conductive filler, an inorganic reinforcing filler, an organic reinforcing filler, and a crosslinking agent, characterized in that it comprises an organosilicon rubber; a thermally conductive substance in the form of metallic particles in an amount of 75-200 parts by weight per 100 parts by weight of rubber, an organic reinforcing filler in the form of two species of carbon black particles in an amount of 10-100 parts by weight, whereby the ratio by weight of the first carbon black species to the second carbon black species is 2:3 by weight, and in addition are carbon black particles with an iodine number of 50 to 150 g/kg and technical carbon black particles with an iodine number of 10 to 49 g/kg; an inorganic reinforcing filler in the amount of 5-100 parts by weight per 100 parts by weight of rubber; and a crosslinking agent in the amount of 0.1-5 parts by weight per 100 parts by weight of rubber.