Elastomeric Heat Spreader with Slider Pins for Co-Planarity Compensation
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Solution Overview
Problem
Existing cooling solutions for multi-package modules and multi-chip modules face challenges in maintaining optimal thermal interface material thickness and ensuring consistent heat transfer due to manufacturing and assembly tolerances, leading to inefficient heat removal from closely packed heat sources with varying package heights and lack of co-planarity.
Innovation Solution
A heat spreader design incorporating an elastomeric base with slider pins and an alignment frame, which compresses thermal interface material to a desired thickness and includes a captivated heat transfer material, allowing for efficient heat transfer across multiple package thicknesses and areas while compensating for co-planarity issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If varying bondline thickness is used to accommodate different package heights, then manufacturing adaptability is improved, but heat transfer reliability deteriorates
Solution Approach 1:
The elastomeric base is designed to be compliant and deformable, allowing it to dynamically adapt to varying package heights while maintaining consistent thermal contact. The material's elastic properties enable it to conform to different bondline thicknesses without compromising heat transfer reliability, resolving the contradiction between adaptability and consistency.
Solution Approach 2:
The invention changes the physical state of the base from rigid to elastomeric, allowing the bondline thickness to be optimized for each package while maintaining overall system adaptability. This parameter change enables both varying thickness accommodation and consistent thermal performance across different package configurations.
2Adaptability or versatility
If multiple individual packages are used to accommodate different component heights, then manufacturing flexibility is improved, but device complexity increases
Solution Approach 1:
The invention merges multiple individual package structures into a single integrated module package with a unified elastomeric base. This consolidation reduces device complexity by eliminating the need for multiple separate packages while maintaining the flexibility to accommodate different component heights through the compliant base material.
Solution Approach 2:
The single module package with elastomeric base serves multiple functions: it accommodates various component heights, provides thermal management, and simplifies the overall structure. This multi-functional design reduces device complexity while maintaining manufacturing flexibility.
3Strength
If rigid heatsink base is used to maintain structural stability, then structural strength is improved, but adaptability to co-planarity variations deteriorates
Solution Approach 1:
The invention replaces the rigid heatsink base with an elastomeric base that has flexible, conformable properties. This flexible base can adapt to co-planarity variations and manufacturing tolerances while maintaining structural integrity, resolving the contradiction between structural strength and adaptability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively maintains optimal bondline thickness for thermal interface material, ensuring reliable and consistent heat removal from multiple heat sources with varying dimensions and co-planarity, enhancing thermal management in complex module configurations.
Implementation Method 1
The optimal bondline thickness is the thickness in which the TIM 302, 304, 306, 308, 310 can best conduct the thermal energy from the respective sources 102A-110 to the heatsink 330
Implementation Method 2
an elastomeric base, which allows for adjustable thermal interface material compression to maintain optimal bondline thickness
Data Source
AI summary
A heatsink includes a heatsink base, an elastomeric base, multiple slider pins and an alignment frame coupled to the heatsink base. The elastomeric base includes multiple holes, the elastomeric base coupled to the perimeter of the heatsink base. Each of the slider pins secured in one of the holes in the elastomeric base. The alignment frame supporting and aligning the slider pins as the slider pins move in a direction substantially perpendicular to the heatsink base. A method of assembling a heat spreader is also described.