Elastomeric Interconnect with Boron Nitride for Thermal Management
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Solution Overview
Problem
Conventional elastomeric interconnect structures face challenges in efficiently dissipating heat from high-frequency circuit board components due to their limited thermal conductivity, especially when configured with air-filled cavities that hinder heat transfer.
Innovation Solution
Incorporating a thermally conductive and electrically insulative material, such as boron nitride, into the elastomeric matrix at a concentration of 10-30% volume, which enhances thermal conductivity while maintaining electrical insulation, allowing for both electrical conduction and effective heat removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional elastomeric interconnect structures are used, then electrical conduction is achieved, but thermal conductivity is limited
Solution Approach 1:
The patent applies composite materials by combining elastomeric matrix with thermally conductive and electrically insulative particles (such as boron nitride, aluminum oxide, or silicon oxide) to create a hybrid material structure. This composite approach enables the material to simultaneously achieve high thermal conductivity for heat dissipation while maintaining electrical insulation properties, directly resolving the contradiction between thermal performance and electrical functionality.
Solution Approach 2:
The patent changes the thermal conductivity parameter of the elastomeric material by incorporating particles with high thermal conductivity (k ≥ 2 W/mK). By modifying the material composition and particle concentration, the thermal conductivity of the elastomeric interconnect is enhanced from conventional low levels to sufficient levels for heat dissipation, while the electrical insulation properties are preserved through careful selection of electrically insulative particle materials.
2Reliability
If air-filled cavities are used in package configuration, then electrical performance is improved, but heat transfer is hindered
Solution Approach 1:
The patent introduces thermally conductive particles as an intermediary medium within the elastomeric material. These particles act as thermal bridges that facilitate heat transfer through the elastomeric interconnect, compensating for the thermal isolation effect of air-filled cavities. The particles create continuous thermal pathways that enable efficient heat dissipation while the elastomeric matrix and cavity structure maintain electrical insulation.
3Temperature
If thermally conductive material is added to elastomeric matrix, then thermal conductivity increases, but electrical insulation may be compromised
Solution Approach 1:
The patent applies local quality by selecting particles with specific local properties: high thermal conductivity combined with electrical insulation. Materials such as boron nitride, aluminum oxide, and silicon oxide are chosen because they possess high thermal conductivity in their local structure while maintaining electrical insulation. This localized property selection allows the composite material to achieve bulk thermal conductivity enhancement without compromising overall electrical insulation.
Solution Approach 2:
The patent uses composite materials strategy by combining the elastomeric matrix with specifically selected thermally conductive and electrically insulative particles. This composite structure leverages the complementary properties of the constituent materials: the elastomer provides flexibility and electrical insulation, while the particles provide thermal conductivity. The synergistic combination resolves the contradiction between thermal and electrical properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resulting elastomeric material achieves a significant increase in thermal conductivity, enabling efficient heat dissipation from high-frequency circuit board components during operation, while maintaining electrical conductivity and preventing lateral short circuits.
Implementation Method 1
the additive material has a relatively high thermal conductivity (i.e., at least five times higher than the matrix)... This combination of components results in an electrically anisotropic conductive medium with a relatively high thermal conductivity... provides thermal conduction between the circuit board components and the associated circuit board
Implementation Method 2
during the manufacturing process a manufacturer achieves the anisotropic conductivity of ACE by mixing 9-10% magnetic particles by volume with a substantially nonconductive liquid resin... curing the sheet in the presence of a magnetic field. The magnetic field causes the magnetic particles to form electrically conductive columns through the sheet thickness
Data Source
AI summary
An elastomeric material includes an elastomeric matrix having one or more outer surfaces and a set of electrically conductive pathways disposed through the elastomeric matrix. The elastomeric material also includes a thermally-conductive and electrically-insulative material, disposed through the elastomeric matrix, which improves the formation of the electrically conductive pathways.