Elastomeric Composite Interconnect for Low-Force Contact Resistance
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Solution Overview
Problem
Existing conductive composites for moldable interconnects face challenges in achieving very low contact resistance while maintaining excellent mechanical properties, compressibility, and processability, with issues such as high compression forces, durability, and limited mold release properties.
Innovation Solution
Incorporating nonconductive compressible rubber particles into a polymeric matrix with conductive metal particles, where the rubber particles enhance compressibility without compromising mechanical integrity and conductivity, allowing for improved moldability and reduced compression forces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional conductive composites are used to achieve low contact resistance, then electrical conductivity is improved, but compressibility deteriorates and compression forces become excessively large
Solution Approach 1:
The invention uses a composite material system consisting of a polymeric matrix, conductive metal particles for electrical conductivity, and nonconductive compressible rubber particles for enhanced compressibility. This multi-component composite allows simultaneous achievement of low contact resistance through the conductive metal particles network and high compressibility through the rubber particles that can deform under compression, thereby reducing the compression forces needed while maintaining electrical performance.
Solution Approach 2:
The invention applies different functional properties to different components within the composite: conductive metal particles provide electrical conductivity in specific regions where contact is needed, while nonconductive compressible rubber particles provide localized compressibility and deformation capability. This spatial differentiation of functions allows the material to achieve low contact resistance at contact points while maintaining overall compressibility of the interconnect structure.
2Force
If crosslinking density is reduced to improve compressibility, then compressibility is improved, but creep and relaxation performance deteriorates
Solution Approach 1:
The composite material combines a crosslinked polymeric matrix that provides structural integrity and creep resistance with nonconductive compressible rubber particles that provide additional compressibility. The rubber particles can deform and recover independently, offering compressibility enhancement without requiring reduction of the crosslinking density of the main polymer matrix, thereby maintaining creep and relaxation resistance.
Solution Approach 2:
The invention changes the physical state and mechanical properties by incorporating rubber particles with specific compressibility characteristics into the polymeric matrix. This parameter modification allows the composite to achieve higher compressibility through the rubber particle deformation mechanism rather than through reduced crosslinking, thus maintaining the structural stability and resistance to creep and relaxation.
3Reliability
If high loading of conductive particles is used to reduce contact resistance, then electrical conductivity is improved, but processability and mold release properties deteriorate
Solution Approach 1:
The composite material system incorporates nonconductive compressible rubber particles as a matrix modifier that improves processability and mold release properties. These rubber particles act as internal lubricants and reduce adhesion to mold surfaces, allowing easy demolding even when high loadings of conductive metal particles are present. This enables the formulation to achieve low contact resistance through high conductive particle loading while maintaining good processability and mold release characteristics.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composite achieves increased compressibility, reduced contact resistance, and improved moldability, maintaining mechanical properties and conductivity, suitable for applications requiring low volumes of custom patterns with excellent electrical performance.
Implementation Method 1
nonconductive compressible rubber particles dispersed within the polymeric matrix, the nonconductive compressible rubber particles having a greater compressibility than an elastomeric conductive composite
Implementation Method 2
conductive metal particles and nonconductive compressible rubber particles dispersed within the polymeric matrix
Implementation Method 3
a polymeric matrix comprising a crosslinked polymer, a curing agent for catalyzing crosslinking of the polymeric matrix
Data Source
AI summary
A moldable interconnect device for providing an electrical connection between two or more opposing arrays of contacts for establishing an electrical circuit. The moldable interconnect device having an insulting substrate and an array of conductive elements held in the insulating substrate, the conductive elements are made of an elastomeric conductive composite. The composite having a polymeric matrix comprising a crosslinked polymer. The polymer having a curing agent for catalyzing crosslinking of the polymer matrix and conductive metal particles and non-conductive compressible rubber particles dispersed with the polymer matrix. The non-conductive compressible rubber particles having a greater compressibility than the elastomeric conductive composite that is the same as the elastomeric conductive composite but free of non-conductive compressible rubber particles.