Conductive Elastomeric Pin Arrays Without PCB Substrates
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Solution Overview
Problem
The existing methods for manufacturing conductive elastomeric interposers require a printed circuit board (PCB) substrate, which increases manufacturing costs and complexity.
Innovation Solution
A method and structure that utilize conductive elastomer interconnects and/or metal caps joined through a non-conductive medium, with compression limiting structures to form electrical connections without the need for a PCB substrate, using pin-to-pin or pin-to-metal cap configurations with a non-conductive medium.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If PCB substrate is used to structure interconnects, then structural support and electrical connections are provided, but manufacturing costs and device complexity increase
Solution Approach 1:
The patent extracts and eliminates the PCB substrate from the interconnect structure, retaining only the essential conductive elastomeric interconnects and non-conductive medium. This removal of the PCB layer directly reduces manufacturing costs and structural complexity while maintaining the core interconnect functionality through direct pin-to-pin or pin-to-metal cap connections.
Solution Approach 2:
The patent employs composite material structures by combining conductive elastomeric materials with non-conductive media and metal caps. This composite approach replaces the homogeneous PCB substrate with a multi-material system that achieves the same structural and electrical functions at lower cost and complexity, utilizing the specific properties of each material (conductive elastomer for flexibility and connection, non-conductive medium for support, metal caps for electrical contact).
2Ease of manufacture
If conductive elastomeric interconnects are used without PCB substrate, then manufacturing cost and complexity are reduced, but structural support and alignment precision may be compromised
Solution Approach 1:
The patent introduces a non-conductive medium as an intermediary element that provides structural support and precise alignment for the conductive elastomeric interconnects. This mediator fills the functional gap left by removing the PCB substrate, ensuring that pins and metal caps maintain accurate positioning and alignment during assembly and operation, thereby preserving manufacturing precision without the costly PCB infrastructure.
3Reliability
If compression limiting structures are added to control elastomer compression, then connection reliability is improved, but device complexity increases
Solution Approach 1:
The patent merges the compression limiting function directly into the existing non-conductive medium or integrates it with the metal cap structure, rather than adding separate complex compression control mechanisms. This consolidation achieves reliable compression control (limiting elastomer compression to 10%-40% of non-compressed height) while minimizing additional structural complexity by combining multiple functions into unified components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach eliminates the need for PCB substrates, reducing manufacturing costs and simplifying the process while maintaining effective electrical interconnects by using conductive elastomer structures and compression limiters within a non-conductive medium.
Implementation Method 1
Conductive elastomeric interconnects and/or metal caps are joined together using conductive elastomer structures through a hole in the non-conductive medium
Implementation Method 2
Compression limiting structures, such as but not limited to Kapton, are used to limit conductive elastomeric interconnect compression strokes to within target ranges of 10%-40% of the non-compressed height of the elastomers
Data Source
AI summary
An improved method and structure is provided for constructing elastomeric pin arrays using a non-conductive medium and compression limiters. Pin to pin of the same elastomeric material, pin to pin of similar elastomeric material, or pin to metal cap structure interconnects are constructed using an elastomeric connection through a non-conductive medium. Compression limiting structures are mated to the non-conductive medium. This structure eliminates the need for PCB structures as the medium reducing manufacturing cost.