Conductive Elastomeric Pin Connector for Fine Pitch Interconnect
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Solution Overview
Problem
Existing pogo pin connectors face challenges in achieving a pitch of 0.5 millimeters, making them expensive and difficult to manufacture, especially when trying to connect high-value integrated circuits to printed circuit boards, as they require mechanical springs for electrical coplanarity, which is costly and hard to achieve.
Innovation Solution
The use of conductive elastomeric and mechanical pin systems, where conductive polymer 'flex dots' are injected into holes in an insulator board, providing flexible, conductive contacts that can protrude above the surface to connect with ball grid arrays or LAN pads, eliminating the need for mechanical springs and allowing for smaller pitch connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If mechanical springs are used to achieve electrical coplanarity in pogo pin connectors, then electrical coplanarity is improved, but manufacturing cost and complexity increase
Solution Approach 1:
The patent replaces the mechanical spring system with a conductive elastomeric material that provides electrical coplanarity through its inherent elasticity and conformability. The elastomeric material can deform to accommodate surface irregularities and maintain consistent electrical contact without requiring complex mechanical spring structures, thereby reducing device complexity while maintaining electrical coplanarity.
Solution Approach 2:
The patent uses composite materials by combining conductive particles or metal flakes within an elastomeric matrix. This composite structure provides both the mechanical compliance needed for electrical coplanarity and the electrical conductivity required for signal transmission, eliminating the need for separate mechanical spring components and simplifying the overall connector design.
2Productivity
If pitch is reduced to 0.5 millimeters in pogo pin connectors, then connection density is improved, but manufacturing difficulty and cost increase
Solution Approach 1:
The patent employs a flexible elastomeric material that can be molded into thin film structures with fine pitch patterns. This flexibility allows the material to conform to fine pitch requirements (0.5mm and below) without the manufacturing complexity associated with rigid mechanical springs, enabling high-density connections while maintaining ease of manufacture through molding processes.
Solution Approach 2:
The patent changes the physical parameters of the connector system by transitioning from rigid mechanical components to a soft, compliant elastomeric material. This parameter change enables the system to achieve fine pitch dimensions (0.5mm) that are difficult to manufacture with traditional rigid pogo pins and springs, while the molding process maintains manufacturing simplicity.
3Ease of manufacture
If conductive elastomeric material is used instead of mechanical springs, then manufacturing cost is reduced, but electrical conductivity must be maintained
Solution Approach 1:
The patent creates a composite material system where conductive particles (such as metal flakes, powder, or coated particles) are dispersed within an elastomeric matrix. This composite structure maintains electrical conductivity through the conductive particle network while the elastomeric base material provides compliance and cost-effective manufacturing through molding processes, replacing expensive mechanical spring assemblies.
Solution Approach 2:
The patent effectively creates a functional copy of the mechanical spring's electrical coplanarity function using a different material system. Instead of relying on mechanical spring deformation, the conductive elastomeric material copies the electrical contact function through its own elastic deformation and conformability, achieving the same reliability outcome at lower manufacturing cost.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables reliable, low-cost, high-density connections with reusability, reducing the need for solder and pins, and supports fine conductor pitches, making it suitable for semiconductor applications and other high-value connections.
Implementation Method 1
conductive polymer 'flex dots' are injected into holes in an insulator board, providing flexible, conductive contacts
Implementation Method 2
conductive elastomeric and mechanical pin systems, where conductive polymer 'flex dots' are injected into holes in an insulator board, providing flexible, conductive contacts
Data Source
AI summary
A conductive elastomeric and mechanical pin and contact system for creation of a Elastromechanical Connector (1) that combines Mechanical Pins, an Insulator Array with Conductive Elastromeric Memory Material. This combination provides a low cost, high density, reliable, reusable electronic interconnect system. This system can be used in place of most connector systems in use today. It replaces any connector that uses pins and sockets and also supports the fine conductor pitch required in the semiconductor business like Ball Grid Array (BGA) Sockets and related devises. The inventive device includes mechanical pins (2), installed in an insulator (3), each mechanical pin is topped with conductive elastromeric compound (4). A mechanical pin is used for each connection point, the insulator positions the mechanical pins in an array pattern appropriate to the interconnection requirement. A conductive elastromeric compound is added to each metal pin to create the Z axis electrical coplanality to the mating unit. This connector will mate between printed circuit boards, packaged electronic assembles, BGAs or LGA type products, harnesses or cables without the need of solder or pins and sockets. Eliminating solder or pins and sockets reduces the pitch between connections. Mechanical pins are plated drawn, formed or machined conductive metal alloys. Insulator is molded or machined out of engineered plastic examples being, but not limited to, FR-4, Ultem®, Polyimide, Torlon®. Electrically conductive elastromeric compounds made up of flexible silicone and rubbers with conductive compounds added.