Conductive Elastomeric Pin Arrays via Solder Interconnects

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Solution Overview

Problem

The existing methods for manufacturing conductive elastomeric interposers require Printed Circuit Board (PCB) substrates, which are costly and inefficient, necessitating a solution to eliminate the need for these substrates in the interconnect structure.

Innovation Solution

A method and structure using conductive elastomer pins soldered through holes in a non-conductive medium, eliminating the need for a PCB substrate by forming electrical interconnects without a via/pad structure, and utilizing compression stops to secure and limit the compression of elastomeric columns.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If PCB substrates are used as mediums for structuring interconnects, then structural support and electrical connectivity are achieved, but manufacturing costs increase and manufacturing complexity increases

Engineering Contradiction:

Improvemanufacturing costVSAvoidPCB substrate structure

Core Design Contradiction:

Ease of manufactureVSDevice complexity

Solution Approach 1:

The patent extracts and eliminates the PCB substrate from the interconnect structure, retaining only the essential functional elements (conductive elastomeric pins and non-conductive medium). This removal of the expensive PCB substrate directly reduces manufacturing costs while maintaining the core interconnect functionality through alternative support structures.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent segments the traditional PCB-based interconnect into discrete components: conductive elastomeric pins, non-conductive medium, and compression stops. This segmentation allows each component to be optimized independently and assembled flexibly, reducing the need for expensive PCB substrate while maintaining structural integrity and electrical connectivity.

Inventive Principle:

Principle #1Segmentation

2Productivity

If PCB substrates are used for interconnect structure, then electrical connectivity is achieved, but manufacturing efficiency decreases

Engineering Contradiction:

Improvemanufacturing efficiencyVSAvoidvia/pad structure

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The patent removes the complex via/pad structure associated with PCB substrates and replaces it with a simplified assembly of conductive elastomeric pins inserted through a non-conductive medium. This extraction of the essential interconnect function from the complex PCB substrate significantly improves manufacturing efficiency by eliminating time-consuming PCB fabrication steps.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The conductive elastomeric pins are pre-formed with their conductive properties before assembly, and the non-conductive medium is prepared with appropriate openings. This preliminary preparation of components allows for rapid assembly without the need for complex PCB via drilling and plating processes, thereby improving manufacturing efficiency.

Inventive Principle:

Principle #10Preliminary action

3Ease of manufacture

If conductive elastomeric pins are soldered through non-conductive medium, then PCB substrate is eliminated, but manufacturing precision requirements increase

Engineering Contradiction:

ImprovePCB substrate eliminationVSAvoidpin placement precision

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The non-conductive medium serves as an intermediary structure that provides precise positioning features and guidance for the conductive elastomeric pins during assembly. This intermediary component ensures accurate pin placement without requiring high-precision PCB substrate fabrication, thereby maintaining ease of manufacture while achieving necessary manufacturing precision.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent replaces the mechanical PCB substrate structure with a combination of non-conductive medium and compression stops that provide mechanical support and positioning. This substitution allows for easier manufacturing through standard assembly processes while maintaining the precision needed for reliable electrical connections through the conductive pins.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces manufacturing costs and simplifies the placement of conductive elastomer interposers by eliminating the need for PCB substrates, while ensuring reliable electrical connections and efficient material usage.

Implementation Method 1

solder interconnects

Methodology Applied

Scientific EffectSoldering: Soldering

Implementation Method 2

compression stops

Methodology Applied

Scientific EffectMechanical Force: Mechanical Force

Data Source

PatentUS9742091B2Method and structure for conductive elastomeric pin arrays using solder interconnects and a non-conductive medium

Publication Date: 2017.08.22 R&D SOCKETS INC

AI summary

A method and structure is provided for constructing elastomeric pin arrays using solder interconnects and a non-conductive medium. Pin to pin interconnects are constructed using a solder connection through a non-conductive medium. This structure eliminates the need for PCB structures as the medium, reducing manufacturing cost. In another embodiment one or more elastomeric columns extend through holes or openings in the non conductive medium. The elastomeric columns are fixed securely within the holes preferably with adhesive material. Compression stops are provided on both sides of each elastomeric column for both the upper and bottom surfaces of the non conductive medium.