Elastomeric Relief Element Multilayer Printing
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Solution Overview
Problem
Current methods for forming high-resolution patterns using relief images face challenges in achieving consistent and uniform fine lines, particularly with conductive inks, due to issues with ink release, affinity, and internal cohesiveness, and alignment in multilayer structures, which limits their application in electronic and optoelectronic devices.
Innovation Solution
A method involving an elastomeric relief element with a relief pattern of at least 50 μm depth, where multiple printable material compositions with different carrier liquids are applied and partially cured to form a multilayer structure, which is then transferred to a receiver element, enhancing the resolution and conductivity of the printed pattern.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional photolithographic processes are used to form high-resolution patterns, then pattern resolution can be achieved, but the process becomes complex and costly
Solution Approach 1:
The patent uses a relief image element as a physical template or stamp that directly transfers the pattern to the substrate. This copying approach eliminates the need for complex photolithographic steps including photoresist coating, exposure, and development, while maintaining high pattern resolution through the precision of the relief image structure
Solution Approach 2:
The patent replaces the complex chemical and optical processes of photolithography with a direct mechanical transfer process using a relief image element. The relief image physically contacts the substrate and transfers material or catalytic species through mechanical means, simplifying the overall manufacturing process
2Ease of manufacture
If relief image methods are used to print conductive inks, then pattern formation is simplified, but ink release, affinity, and internal cohesiveness issues reduce manufacturing precision
Solution Approach 1:
The patent modifies the surface properties of the relief image element by treating it to enhance wettability. This parameter change in surface energy allows the conductive ink to spread uniformly across the relief features while maintaining sharp edges, improving both ink transfer efficiency and line uniformity
Solution Approach 2:
The patent creates different surface properties at different locations on the relief image element. The relief features have enhanced wettability for better ink holding, while the non-relief areas maintain release properties. This local differentiation ensures precise ink placement and consistent fine line formation
3Adaptability or versatility
If multiple printable material compositions are applied sequentially, then multilayer structures can be formed, but alignment difficulties reduce manufacturing precision
Solution Approach 1:
The patent uses the same relief image element as a consistent template for transferring multiple different printable material compositions. Each material is applied sequentially to the identical relief features, ensuring perfect registration and alignment across multiple layers without requiring complex alignment mechanisms
Solution Approach 2:
The relief image element serves as its own alignment reference for multiple printing operations. The physical structure of the relief features automatically provides registration marks and alignment guidance, eliminating the need for external alignment systems or complex control mechanisms
4Manufacturing precision
If carrier liquid is removed from printable material compositions, then conductivity and feature uniformity improve, but processing time increases
Solution Approach 1:
The patent performs partial carrier liquid removal and preliminary curing of the printable material composition while it is still on the relief image element, before transfer to the substrate. This preliminary processing ensures proper material properties and conductivity while the structure is constrained by the relief features, reducing processing time on the substrate
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the creation of high-resolution multilayer structures with improved conductivity and feature uniformity, suitable for electronic and optoelectronic devices, by effectively removing carrier liquids and forming a multilayer structure with enhanced electrical properties.
Implementation Method 1
an elastomeric relief element with a relief pattern of at least 50 μm depth
Implementation Method 2
wherein the first and second printable material compositions each independently comprise a carrier liquid, and wherein at least some of the carrier liquid is removed from the first and second printable material compositions
Data Source
AI summary
A multilayer structure having at least two different print materials pattern is formed on a receiver element using an elastomeric relief element having a relief pattern. Multiple different printable material compositions are sequentially applied only to the uppermost relief surface of the elastomeric relief element and at least at least 50 weight % of a carrier liquid is removed from each printable material composition. During contact of the multilayer structure on the uppermost relief surface and the receiver element, the elastomeric relief element is compressed by at least 10 μm of its original thickness. The elastomeric relief element is then separated from the receiver element to leave a pattern of the multilayer structure on the receiver element, wherein at least 70 weight % of the multiple print materials is transferred to the receiver element.