Electret Microphone Sidewall Wiring Reduces Parasitic Capacitance
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Solution Overview
Problem
Current electret condenser microphones face challenges in reducing manufacturing costs without compromising performance metrics such as electroacoustic sensitivity, frequency response, noise level, and housing volume, while also requiring a complex assembly process with multiple components.
Innovation Solution
The design incorporates a non-conductive exterior sidewall structure with integrated electrical wiring patterns that serve as an intermediate coupling member between the conductive perforated backplate and microphone diaphragm, eliminating the need for separate conductive members and allowing for flexible wiring routing, thereby reducing parasitic capacitance and part count, and utilizing printed circuit board technology for cost-effective and simplified assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional separate conductive members are used for electrical connection, then reliable electrical connectivity is achieved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent combines the electrical connection function with the housing structure by integrating conductive traces directly into the housing walls. The housing serves dual purposes: structural support and electrical connectivity, eliminating the need for separate conductive members and reducing overall device complexity.
Solution Approach 2:
The housing structure is designed to perform multiple functions simultaneously: it provides mechanical support, defines the device geometry, and establishes electrical connections through integrated conductive traces. This multi-functionality reduces the total number of components required.
2Manufacturing precision
If complex assembly processes are used, then precise component alignment is achieved, but manufacturing cost and production time increase
Solution Approach 1:
The conductive traces are pre-integrated into the housing structure during manufacturing, establishing electrical connection paths before final assembly. This preliminary integration simplifies the final assembly process and reduces the number of steps required to achieve precise component alignment.
Solution Approach 2:
The housing is designed as modular sections with integrated electrical traces, allowing independent manufacturing and testing of segments before final assembly. This segmentation enables parallel production and simplifies quality control while maintaining manufacturing precision.
3Adaptability or versatility
If more separate components are used, then functional requirements are met, but manufacturing cost increases
Solution Approach 1:
The patent merges multiple functional requirements into the housing structure itself. The housing provides mechanical support, acoustic isolation, and electrical connectivity through integrated traces, reducing the bill of materials and manufacturing complexity while meeting all functional requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a cost-effective electret condenser microphone with reduced parts count, simplified assembly, increased back chamber volume, and improved electroacoustic performance by minimizing parasitic capacitance and external noise interference, while maintaining high sensitivity and frequency response.
Implementation Method 1
ECMs are capacitor microphones which rely on a permanently charged electret layer arranged on the back plate of the ECM to provide a DC bias voltage for the capacitive transducer element. The permanently charged electret layer can for example be a Teflon layer wherein electrical charges are injected and permanently trapped.
Implementation Method 2
ECMs are capacitor microphones which rely on a permanently charged electret layer arranged on the back plate of the ECM to provide a DC bias voltage for the capacitive transducer element.
Data Source
AI summary
The present invention relates to an electret condenser microphone which comprises an exterior sidewall structure attached to a carrier. The exterior sidewall structure comprises a non-conductive base material carrying first and second electrical wiring patterns electrically connected to first and second electrical traces, respectively, of the carrier. A diaphragm holder, carrying a conductive microphone diaphragm is attached to the sidewall structure to establish electrical connection between a conductive microphone diaphragm and one of the first and second electrical wiring patterns of the sidewall structure. A conductive perforated backplate is arranged in spaced relationship to the conductive microphone diaphragm. The conductive perforated backplate is electrically connected to another one of the first and second wiring patterns of the sidewall structure. The sidewall structure may therefore be utilized to provide electrical connectivity from the conductive microphone diaphragm and from the backplate to a microphone preamplifier arranged on the carrier.