Electric Apparatus Unit Mold Accuracy Reduction via Segmented Sealing
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Solution Overview
Problem
Existing electrical equipment units require high accuracy in mold formation due to varying heights of electronic components, leading to increased manufacturing complexity and costs.
Innovation Solution
The design incorporates a substrate with first and second surfaces, where shorter second electronic components are covered by insulating resin, and taller first components are sealed by a lid and side surface part, reducing the need for precise mold accuracy and resin usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the mold is formed along the contour of all electronic components to ensure complete coverage, then the sealing reliability is improved, but the manufacturing precision requirement increases due to varying component heights
Solution Approach 1:
The sealing structure is divided into two segments: a mold-formed insulating resin portion for shorter components and a separate lid for taller components. This segmentation allows each part to be optimized independently, reducing the need for high overall mold precision while maintaining sealing reliability for all components.
Solution Approach 2:
The solution transitions from a single-plane sealing approach to a multi-level three-dimensional structure. The lid extends vertically to cover tall components that exceed the insulating resin height, adding a vertical dimension to the sealing strategy and eliminating the need for the mold to precisely follow the contour of all varying-height components.
2Reliability
If the insulating resin is formed to cover all electronic components, then the coverage is improved, but the manufacturing complexity and cost increase
Solution Approach 1:
The covering function is segmented between the insulating resin (for shorter components) and the lid (for taller components). This division simplifies the manufacturing process by allowing the insulating resin to be formed with lower precision requirements, while the lid is added as a separate component, reducing overall manufacturing complexity.
Solution Approach 2:
The requirement for the mold to precisely follow the contour of all electronic components is extracted and replaced by the lid structure. This removes the complexity of high-precision mold formation while ensuring complete coverage of all components regardless of height variations.
3Manufacturing precision
If the mold accuracy is increased to accommodate varying component heights, then the positioning precision is improved, but the manufacturing cost increases
Solution Approach 1:
The positioning function is segmented: the mold provides basic positioning for the insulating resin, while the lid provides additional positioning for tall components. This segmentation allows the mold to have lower precision requirements, reducing manufacturing costs while maintaining adequate positioning precision through the combined structure.
Solution Approach 2:
Instead of investing in expensive high-precision molds, the solution uses a simpler, less expensive mold for the insulating resin and adds an economical lid component to achieve the required positioning precision, thereby reducing overall manufacturing cost.
Data Source
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AI summary
The present invention is an electrical equipment unit capable of reducing the accuracy of a mold. A substrate (1) includes a pair of surfaces (1a, 1b) opposing to each other in a direction (D). First electronic components (2) are provided on one surface (1a). Second electronic components (3) lower than a maximum value of the height of the first electronic components (2) in a direction (D) are provided on the other surface (1b). Insulating resin (5) includes a covering part (5b) adhering and covering the second electronic components (3) and the other surface (1b), and side surface part (5a) extending from the periphery of the substrate (1) to a side of the second electronic components (2) along the direction (D). A lid (6) covers the first electronic components (2) from an opposite side of the substrate (1), and is fixed to the side surface part (5a) from the opposite side of the substrate (1).