Electric component module and outdoor unit for air conditioner
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Solution Overview
Problem
In electrical component modules, space constraints prevent the mounting of a heat sink when using refrigerant cooling, as the substrate with the power element is on the back surface of a holder, making it difficult to integrate a heat sink for cooling.
Innovation Solution
The configuration involves a first substrate on the front surface of a holder, a second holder perpendicular to the first holder with a substrate and a heat sink, and a third substrate on the back surface, allowing for easy mounting of the heat sink and optimizing space usage by connecting all substrates via lines.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If substrates are mounted on both surfaces of a holder to save space, then space utilization is improved, but it becomes impossible to ensure space for mounting a heat sink on the back surface
Solution Approach 1:
The patent transitions from a two-dimensional planar mounting arrangement to a three-dimensional spatial configuration by introducing a vertically extending holder. The holder rises upward from the base plate, creating multiple levels (front surface, back surface, and upper surface) for substrate mounting. This vertical dimension allows the heat sink to be mounted on the back surface of the holder without interfering with substrates on the front surface or upper surface, thereby resolving the space conflict.
Solution Approach 2:
The patent implements a nested arrangement where substrates are mounted on different surfaces of the same holder structure. The front substrate, back substrate, and heat sink are nested in three-dimensional space around the vertical holder, with each component occupying a different spatial zone. This nested configuration maximizes space utilization while ensuring adequate mounting space for the heat sink on the back surface.
2Temperature
If refrigerant cooling is adopted to cool power element, then cooling effect is improved, but space for cooling path must be provided which increases module size
Solution Approach 1:
The patent replaces the refrigerant cooling system (mechanical/chemical cooling path) with a passive heat sink mounted on the back surface of the holder. The heat sink dissipates heat from power elements through thermal conduction and convection to the surrounding air, eliminating the need for refrigerant circulation paths and associated components, thereby reducing the overall module volume while maintaining cooling effectiveness.
Solution Approach 2:
The heat sink provides self-service cooling by passively dissipating heat from power elements to the ambient environment without requiring an active refrigerant circulation system. The cooling function is achieved through the natural heat transfer properties of the heat sink structure itself, eliminating the need for complex cooling paths and reducing space requirements.
3Area of stationary object
If substrate with power element is disposed on back surface of holder, then space saving is achieved, but connection complexity increases due to line routing
Solution Approach 1:
The vertical holder structure creates distinct spatial zones for different substrates, allowing line routing to proceed vertically along the holder rather than requiring complex lateral routing across a single plane. This three-dimensional arrangement simplifies connection paths by utilizing the vertical dimension for both mechanical support and electrical interconnection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables effective heat radiation using the heat sink, saving space in the electrical component module and facilitating easier connection of components, while maintaining efficient cooling and compactness.
Implementation Method 1
a power element is cooled by heat radiation by a heat sink
Data Source
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AI summary
An electrical component module is provided in which a heat sink is applied as a cooling unit for a power element and space can be saved. The electrical component module includes: a first holder having substrate holding structures on a first surface portion and a second surface portion located on a back-surface side of the first surface portion; a second holder disposed perpendicular to the first holder at an end portion of the second surface portion of the first holder and having a substrate holding structure on one surface of the second holder; a first substrate held on the first surface portion of the first holder; a second substrate and a heat sink both held by the second holder; and a third substrate held on the second surface portion of the first holder, and connected to the first substrate and the second substrate by a line.