Movable Electric Field Adjusting Ring for Plasma Etching
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Solution Overview
Problem
The etching process in semiconductor manufacturing using plasma often results in reduced accuracy and efficiency due to changes in the incident angle of etching ions, leading to premature wear of the focus ring and increased maintenance costs.
Innovation Solution
A substrate treating apparatus with a support unit that includes a focus ring, an electric field adjusting ring, and an actuator to vertically move the electric field adjusting ring, using magnetic or fluid pressure to adjust the electric field and maintain the incident angle of etching ions, thereby improving process accuracy and extending the replacement period of the focus ring.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If RF power is supplied to the electrode plate to generate electric field for etching ions, then the etching process can be performed, but the incident angle of etching ions changes as the focus ring is etched, leading to reduced manufacturing precision
Solution Approach 1:
The patent applies the dynamics principle by making the electrode plate movable in the vertical direction. The electrode plate position is dynamically adjusted based on the etching depth of the focus ring, allowing the electric field distribution to be maintained at optimal levels throughout the etching process. This dynamic adjustment compensates for the changing geometry as the focus ring is etched, preventing incident angle changes and maintaining etching precision throughout the focus ring's service life.
Solution Approach 2:
The patent implements parameter changes by varying the vertical position of the electrode plate during the etching process. As the focus ring is etched and its thickness decreases, the electrode plate position is adjusted to maintain the appropriate electric field strength and distribution. This parameter adjustment ensures that the incident angle of etching ions remains consistent, thereby maintaining manufacturing precision while extending the usable life of the focus ring.
2Manufacturing precision
If the focus ring is periodically replaced to maintain etching accuracy, then manufacturing precision is preserved, but maintenance cost increases
Solution Approach 1:
By implementing a movable electrode plate that can be dynamically repositioned, the system eliminates the need for periodic focus ring replacement. The dynamic adjustment of electrode plate position maintains etching accuracy throughout the entire service life of the focus ring, transforming a system that required frequent maintenance into one that operates continuously without replacement cycles.
Solution Approach 2:
The system implements self-service by automatically adjusting the electrode plate position in response to the etching progress. This self-adjustment mechanism maintains optimal etching conditions without requiring external intervention or focus ring replacement, thereby eliminating maintenance costs associated with focus ring replacement while preserving manufacturing precision.
3Productivity
If the incident angle of etching ions changes during the process, then the etching process continues, but the accuracy and efficiency of the etching process deteriorate
Solution Approach 1:
The movable electrode plate enables dynamic compensation for incident angle changes. By adjusting the electrode plate position vertically, the system maintains the optimal incident angle of etching ions on the substrate throughout the etching process. This dynamic adjustment ensures that both etching efficiency and manufacturing precision are maintained at high levels, preventing the deterioration that would otherwise occur as the focus ring is etched.
Solution Approach 2:
The system utilizes parameter changes by adjusting the electrode plate position to compensate for incident angle variations. As the focus ring thickness decreases during etching, the electrode plate is repositioned to maintain the appropriate electric field geometry, thereby keeping the incident angle of etching ions within the optimal range for both efficiency and precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus enhances the accuracy and efficiency of the etching process while reducing the maintenance and replacement costs associated with the focus ring by dynamically adjusting the electric field to maintain consistent ion incidence.
Implementation Method 1
the actuator may vertically move the electric field adjusting ring by magnetic force
Implementation Method 2
plasma is generated by very high temperature, a strong electric field, or radio-frequency (RF) electromagnetic fields
Implementation Method 3
an electric field may be generated over the electrode plate, and an incident angle of the etching ions may be affected while the etching ions pass through the electric field
Data Source
AI summary
The inventive concepts provide a substrate treating apparatus. The substrate treating apparatus includes a process chamber in which a treatment space is provided, a support unit supporting a substrate in the process chamber, a gas supply unit supplying a gas into the process chamber, and a plasma source generating plasma from the gas. The support unit includes a support plate on which a substrate is loaded, a focus ring disposed to surround the support plate, an electric field adjusting ring disposed under the focus ring, and an actuator vertically moving the electric field adjusting ring.