Electric Linear Drive Composite PCB Shielding
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Solution Overview
Problem
Existing electric linear drives face challenges in achieving a favorable balance between production costs, installation space requirements, and performance, particularly in efficiently utilizing space and materials while maintaining high performance capabilities.
Innovation Solution
The electric linear drive employs a multilayer printed circuit board structure with a composite circuit design, featuring shielding and winding layers made of conductive material applied to insulating layers, allowing for high conductor density and efficient use of space, with comb-shaped shielding layers and thick conductor windings, enabling high voltage operation and integration of temperature monitoring components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Force
If conventional single-layer or simple multilayer circuit boards are used, then production costs are lower and structure is simpler, but conductor density and force generation per volume are insufficient
Solution Approach 1:
The patent transitions from conventional single-layer or simple multilayer circuit boards to a complex multilayer structure with at least 16 layers, utilizing the vertical dimension to increase conductor density. By stacking multiple conductor layers separated by insulator layers, the design achieves higher force generation per volume without increasing the horizontal footprint of the linear drive.
Solution Approach 2:
The circuit board employs composite materials combining conductor layers (copper or copper alloy with 70-200 μm thickness), insulator layers (fiber-reinforced plastic or resin composite), and shielding layers. This composite structure optimizes both mechanical strength and electromagnetic performance while achieving high conductor density for improved force generation.
2Weight of moving object
If conductor layer thickness is increased to improve force generation, then mass inertia increases, but if thickness is reduced to lower mass inertia, then conductor coverage and current capacity decrease
Solution Approach 1:
Instead of increasing conductor thickness in a single layer, the patent distributes conductors across multiple layers (at least 16 layers total). This vertical distribution maintains high current capacity through increased total conductor cross-section while keeping individual layer thicknesses moderate, thereby controlling mass inertia.
Solution Approach 2:
The conductor system is segmented into multiple thin layers rather than using fewer thick layers. Each conductor layer has controlled thickness (70-200 μm) to balance current capacity with mass considerations, while the cumulative effect of multiple layers achieves the required power handling capability.
3Reliability
If shielding layers are added to improve electromagnetic compatibility and thermal monitoring, then production complexity increases, but without shielding layers, thermal monitoring and EMI protection are insufficient
Solution Approach 1:
The shielding layers serve multiple functions simultaneously: they provide electromagnetic shielding to improve EMI compatibility, act as thermal conduction paths for heat dissipation, and incorporate temperature sensors for thermal monitoring. This multi-functionality reduces the need for separate components, thereby limiting the increase in overall device complexity.
Solution Approach 2:
The shielding layers are integrated directly into the circuit board structure, merging the shielding function with the structural and thermal management functions of the board. Temperature sensors are embedded within the shielding layers, combining monitoring capabilities with the shielding structure itself.
4Power
If conductor material mass is increased to improve current capacity and force generation, then production cost increases, but if conductor mass is reduced to lower cost, then performance decreases
Solution Approach 1:
The patent increases current capacity by utilizing the vertical dimension through multiple conductor layers rather than increasing the mass of individual layers. This approach distributes the conductor material more efficiently through space, achieving high current capacity with optimized material usage and controlled production costs.
Solution Approach 2:
The conductor layers use optimized parameters including thickness (70-200 μm), material composition (copper or copper alloy), and coverage area (75-90% of layer area). These parameter optimizations balance current capacity requirements with material cost, avoiding excessive conductor mass while maintaining required performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design results in a compact, high-performance linear drive with low mass inertia, capable of generating significant force relative to its volume, while optimizing production costs and space usage, and allowing for effective monitoring of thermal conditions.
Implementation Method 1
Electric linear drive with a stator and an actuator which can be moved relative to the stator along the direction of travel and which can generate a driving force in the direction of travel
Data Source
Figure 1~2
AI summary
Electric linear drive (1), having a composite printed circuit board (3) which has turns (15) to which power can be supplied and has the following layer construction: a first external screen arrangement (12) has an insulator layer (10), on both sides of which a screen layer (9, 11) comprising a conductor material is applied; intermediate layers (13) comprising insulating material and turn arrangements (14) alternately adjoin the first external screen arrangement (12), wherein each turn arrangement (14) has a carrier layer comprising an insulator material (10), on both sides of which carrier layer conductor material in the form of turns (15) is applied; a second external screen arrangement (16) is arranged, so as to adjoin an intermediate layer (13) and with a construction which corresponds to the first external screen arrangement (12), on that side of the composite printed circuit board (3) which is opposite said first external screen arrangement.