Electric Pane Connection Coating for Moisture-Stable Solder Joints

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Solution Overview

Problem

Existing panes with electric connection elements face mechanical stress issues due to different coefficients of thermal expansion of materials used in soldering, leading to potential breakage and high repair costs, especially with the transition from lead-containing to lead-free solders which have lower ductility.

Innovation Solution

A pane with an electric connection element featuring a crimped region electrically connected to a conductive coating via a soldering compound, where a corrosion-inhibiting coating made of an electrically insulating material is applied adjacent to the soldering compound to prevent moisture ingress and enhance mechanical stability, using materials like butyl or flux with high rosin content to ensure chemical and mechanical stability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Stability of the object's composition

If lead-containing solders are used for soldering the electric connection element to the electrically conductive coating, then the solder joint has high ductility that can compensate mechanical stresses from thermal expansion differences, but lead-containing solders are prohibited by legal regulations and must be replaced

Engineering Contradiction:
Improveductility of solder jointVSAvoidlegal regulations prohibiting lead-containing solders
Core Design Contradiction:
Stability of the object's compositionVSObject-affected harmful factors

Solution Approach 1:

The patent changes the material parameters of the soldering compound by selecting specific compositions (e.g., tin-silver-copper alloys, tin-bismuth alloys) that achieve optimal balance between ductility and mechanical strength. This parameter optimization allows lead-free solders to compensate thermal expansion stresses while meeting regulatory requirements.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent employs composite material systems consisting of multiple layers: the electrically conductive coating, the soldering compound, and the corrosion-inhibiting coating. This composite structure provides synergistic effects where each layer contributes specific properties (electrical conductivity, mechanical bonding, corrosion protection) to achieve overall joint reliability without lead.

Inventive Principle:
Principle #40Composite materials

2Object-affected harmful factors

If leadfree solders are used to replace lead-containing solders, then legal regulations are complied with, but the solder joints have lower ductility and reduced ability to compensate mechanical stresses from thermal expansion differences

Engineering Contradiction:
Improvecompliance with legal regulationsVSAvoidductility of solder joint
Core Design Contradiction:
Object-affected harmful factorsVSStability of the object's composition

Solution Approach 1:

The patent optimizes the compositional parameters of lead-free soldering compounds (e.g., specific ratios of tin, silver, copper, or bismuth) to achieve enhanced ductility and stress compensation capabilities while maintaining lead-free status for regulatory compliance.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The corrosion-inhibiting coating acts as an intermediary layer between the soldering compound and the environment, providing additional protection that allows the use of lead-free solders with lower inherent ductility while maintaining overall joint reliability through enhanced environmental resistance.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Reliability

If the solder joint is exposed to moisture from the environment, then corrosion of the electrically conductive coating can occur leading to reduced mechanical stress properties and functional failure over time, but additional protective measures increase device complexity

Engineering Contradiction:
Improvemechanical stress properties of solder jointVSAvoidmoisture-induced corrosion
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The corrosion-inhibiting coating serves as an intermediary protective barrier between the solder joint components (electrically conductive coating and soldering compound) and the corrosive environment (moisture). This intermediate layer prevents direct contact between moisture and the metal surfaces, thereby preventing corrosion while maintaining joint reliability.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The corrosion-inhibiting coating provides a sacrificial protective layer that can be applied economically to prevent corrosion of the critical solder joint components. This relatively simple additional layer protects the expensive and functionally critical solder joint at minimal cost and complexity increase.

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

4Reliability

If a corrosion-inhibiting coating is applied adjacent to the soldering compound to protect against moisture, then the mechanical stability and reliability of the solder joint is enhanced, but the manufacturing process becomes more complex

Engineering Contradiction:
Improvemechanical stability of solder jointVSAvoidnumber of coating layers
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines the corrosion-inhibiting coating application with the existing soldering process by applying the coating adjacent to the soldering compound in the same manufacturing sequence. This merging of protective coating application with the soldering operation enhances reliability while minimizing the increase in manufacturing complexity through process integration.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The corrosion-inhibiting coating effectively prevents moisture-induced corrosion and enhances the mechanical stability of the solder joint, providing a strong and durable connection that can withstand thermal stresses, thus reducing the risk of functional failure and associated costs.

Implementation Method 1

the crimped region electrically conductively connected to the electrically conductive coating via a soldering compound

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 2

a corrosion-inhibiting coating made of an electrically insulating material that protects the underlying structures against moisture

Methodology Applied
Scientific EffectPhysical barrier protection: Physical Containment

Implementation Method 3

The soldering operation can, for example, be carried out by a contact soldering method in which two electrodes are placed on the connection element at a certain distance from one another

Methodology Applied
Scientific EffectSoldering: Soldering

Implementation Method 4

an electric connection element that has a region crimped about a connection cable

Methodology Applied
Scientific EffectMechanical deformation: Deformation

Data Source

PatentUS20240071650A1Pane with electric connection element
Publication Date: 2024.02.29 SAINT GOBAIN SEKURIT FRANCE
  • US20240071650A1 patent drawing
  • US20240071650A1 patent drawing
  • US20240071650A1 patent drawing

AI summary

A pane with at least one electric connection element includes a flat substrate, an electrically conductive coating on the flat substrate, on the electrically conductive coating, an electric connection element having a region crimped about a connection cable, wherein the crimped region is electrically conductively connected to the electrically conductive coating via a soldering compound, a corrosion-inhibiting coating, which is applied, adjacent the soldering compound, on the electrically conductive coating and, at least in sections, on the soldering compound, wherein the corrosion-inhibiting coating is made of an electrically insulating material that protects against moisture, wherein the corrosion-inhibiting coating (i) only partially covers the soldering compound and does not cover the crimped region of the connection element, or (ii) completely covers the soldering compound and only partially covers the crimped region of the connection element.