Electric Part Soldered to PCB with Stepped Solder Space

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Solution Overview

Problem

Conventional electric connectors face challenges in achieving high peel resistance when soldered to metal pads on printed circuit boards, leading to unreliable electrical connections under oscillation, impact, and cable pull forces, due to limited soldered area and potential notch breakage during manufacturing.

Innovation Solution

The design incorporates a solder-filled space between the first and third surfaces of the electric part, with the second surface inclined relative to the first, creating a stepped portion that increases the soldered area and enhances peel resistance, while a method involving punching and reducing the thickness of metal parts forms the necessary contours without generating interfering burrs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the notch is cut by means of a cutter to form fillets, then the plated surface area is increased, but the notch may be broken before it is stretched to be thin

Engineering Contradiction:
Improvepeel resistanceVSAvoidmanufacturing difficulty
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The notch is formed with preliminary dimensions and shape before the cutting process, ensuring it has sufficient structural integrity during manufacturing. The notch dimensions are designed such that it can be stretched to thin form without breaking, while still providing adequate plated surface area for solder attachment and peel resistance.

Inventive Principle:
Principle #10Preliminary action

2Strength

If the soldered area is increased to enhance peel resistance, then the connection strength is improved, but the device complexity increases

Engineering Contradiction:
Improvepeel resistanceVSAvoidstructure complexity
Core Design Contradiction:
StrengthVSDevice complexity

Solution Approach 1:

The invention utilizes the vertical dimension by forming a notch that extends through the thickness of the electric part, creating upwardly bending fillets that increase soldered area in the vertical direction rather than expanding the horizontal footprint. This dimensional approach increases peel resistance without significantly increasing overall device complexity.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Manufacturing precision

If the notch is stretched to be thin to ensure plated surface, then the solder wettability is improved, but the notch may break during cutting

Engineering Contradiction:
Improveplated surface qualityVSAvoidnotch integrity
Core Design Contradiction:
Manufacturing precisionVSStrength

Solution Approach 1:

The invention optimizes the parameters of the notch, including its initial width, depth, and position, to achieve the right balance between being stretchable to thin form for good plated surface quality and maintaining sufficient strength during the cutting process. The notch dimensions are carefully controlled to prevent breakage while ensuring adequate plated area.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration significantly increases the soldered area, resulting in enhanced peel resistance and reliability of the electrical connection, with the solder fillet providing strength against oscillation, impact, and cable pull forces, and ensuring consistent peel resistance.

Implementation Method 1

an electric part to be soldered to a metal pad formed at a surface of a printed circuit board

Methodology Applied
Scientific EffectSoldering: Soldering

Implementation Method 2

solder is adhered to the second and third surfaces when the space is filled with solder

Methodology Applied
Scientific EffectAdhesion: Adhesive

Implementation Method 3

a second surface extending from the first surface in a direction away from the printed circuit board, the second surface and the third surface defining a space in which solder is stored

Methodology Applied
Scientific EffectGeometry: Geometry

Data Source

PatentEP2852002B1Electric part soldered onto printed circuit board
Publication Date: 2018.04.04 I PEX CO LTD
  • EP2852002B1 patent drawingFigure 1
  • EP2852002B1 patent drawingFigure 2
  • EP2852002B1 patent drawingFigure 3A~3B

AI summary

The electric part (30, 30x, 40, 40x) to be soldered to a metal pad (P1, P2) formed at a surface of a printed circuit board (P), includes a first surface (51, 61) facing the metal pad (P1, P2), a second surface (52, 62) extending from the first surface (51, 61) in a direction away from the metal pad (P1, P2), and a third surface (53, 63) outwardly extending from the second surface (52, 62), wherein the second surface (52, 62) and the third surface (53, 63) define a space (S1, S2) in which solder (B) is stored.