Electric Switch Contact Sintering Process
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Solution Overview
Problem
The existing methods for producing electrical switching contacts are complex and costly, requiring high temperatures and multiple steps, including soldering and welding, which can be challenging for certain material combinations and result in high production costs and positional deviations.
Innovation Solution
A method that connects the contact material to the contact carrier via a sinterable silver layer, eliminating the need for a separate solder layer, using a process that involves applying a sinterable layer between the contact pad and carrier, followed by sintering under pressure and temperature, with heat introduction methods like resistance welding, induction soldering, or radiant heat, at temperatures below 300°C and pressures up to 30 MPa.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional soldering and welding methods are used to connect contact pieces to carriers, then reliable electrical connection is achieved, but production cost increases and process complexity increases
Solution Approach 1:
The patent combines the solder layer and silver layer into a single sinterable silver layer that performs both functions. This layer is applied directly to the contact carrier and sintered in one process step, eliminating the need for separate soldering and silver plating operations, thus reducing process complexity while maintaining reliable electrical connection.
Solution Approach 2:
The sinterable silver layer serves multiple functions simultaneously: it acts as the connection layer (replacing solder), provides the ductile buffer (pure silver layer), and enables low-temperature processing. This multi-functional approach reduces the number of components and process steps required.
2Reliability
If multiple layers (solder layer, silver layer, contact material layer) are applied separately, then material properties are optimized, but production time increases and process complexity increases
Solution Approach 1:
The patent merges the application of solder layer and silver layer into a single step by applying a sinterable silver layer that contains both functions. The layer is then sintered in one heat treatment process, significantly reducing production time while maintaining the optimized material structure.
Solution Approach 2:
The sinterable silver layer is prepared in advance with the appropriate composition and structure, so that when applied and sintered, it automatically forms the required multi-layer structure without requiring subsequent separate plating or soldering operations.
3Strength
If high temperatures above 600°C are used for soldering, then strong metallurgical bond is achieved, but material softening occurs and energy consumption increases
Solution Approach 1:
The patent changes the temperature parameter from traditional high-temperature soldering (>600°C) to low-temperature sintering (250-300°C). The sinterable silver layer is specifically formulated to achieve strong metallurgical bonding at these lower temperatures, preventing material softening while maintaining bond strength.
Solution Approach 2:
The sinterable silver layer is a composite material designed to sinter at low temperatures while forming strong bonds. It contains silver particles with appropriate size distribution and binding agents that enable strong metallurgical connection between the contact carrier and contact material at temperatures below 300°C.
4Reliability
If separate solder layer and silver layer are used, then electrical conductivity is optimized, but silver consumption increases and cost increases
Solution Approach 1:
The patent combines the solder layer and silver layer into a single sinterable silver layer, eliminating redundant silver usage. The merged layer is optimized to provide both the connection function and the ductile buffer function with appropriate silver content, reducing overall silver consumption while maintaining electrical conductivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the process, reduces silver usage, lowers production temperatures, enhances electrical conductivity, minimizes material softening, and reduces the cleaning process complexity, while maintaining high arc erosion resistance and contact reliability.
Implementation Method 1
The contact material is connected to the carrier via a sintered layer, in particular a silver layer. The process flow essentially consists of applying a layer of sinterable material between the contact pad and the carrier with subsequent sintering of the structure under the influence of pressure and temperature.
Implementation Method 2
the heat to be generated in the electrical switching contact by means of resistance welding and/or induction soldering and/or ultrasonic welding and/or by means of heating stamps and/or by means of hot gas and/or by means of radiant heat
Implementation Method 3
the heat to be generated in the electrical switching contact by means of resistance welding and/or induction soldering and/or ultrasonic welding and/or by means of heating stamps and/or by means of hot gas and/or by means of radiant heat
Data Source
Figure 1~4
Figure 5~7
AI summary
The invention relates to an electrical switching contact with a contact carrier (1) and a contact surface (2) comprising a contact material (5), and to a method for its manufacture. The invention is characterized in that a sinterable layer (6) is arranged between the contact material (5) and the contact carrier (1) for bonding the contact material (5) to the contact carrier (1).