Electrically Releasable Adhesive Tape for Residue-Free Debonding
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Solution Overview
Problem
Existing adhesive technologies for electronic devices require complex and time-consuming methods to reduce adhesive strength, often leaving residue and necessitating extensive rework, and lack compatibility with metallic substrates while ensuring high initial bond strength and environmental sustainability.
Innovation Solution
An adhesive compound comprising poly(meth)acrylate A with over 15 wt% nitrogen-containing monomers and an electrolyte, preferably ionic liquids, allows for voltage-induced adhesive removal, maintaining high initial strength and stability, even at thick layers, and is resistant to additives.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If heat-mediated separation processes are used to reduce adhesive strength, then the adhesive bond can be separated, but extensive rework is required to prepare the substrate surface contaminated with adhesive residue
Solution Approach 1:
The patent replaces heat-mediated separation with an electrical field-based separation mechanism. By incorporating ionic liquids into the adhesive composition, the adhesive can be removed by applying an electrical voltage that triggers ion migration and adhesive bond failure, eliminating the need for thermal processing and subsequent mechanical cleaning of residue
Solution Approach 2:
The patent changes the fundamental parameter for adhesive removal from thermal energy to electrical energy. The ionic liquid-containing adhesive responds to electrical voltage by undergoing ion migration that weakens and breaks the adhesive bond, providing a cleaner and more efficient removal process compared to thermal methods
2Reliability
If adhesive-dissolving technologies using penetrating solvents are used to achieve high bond strength, then reliable bonding is achieved, but the process takes a very long time to apply
Solution Approach 1:
The patent replaces slow chemical dissolution processes with rapid electrical field-induced separation. The ionic liquid formulation allows the adhesive to achieve high initial bond strength through conventional curing, then enables rapid removal by electrical voltage that triggers immediate ion migration and bond failure, reducing the overall process time significantly
Solution Approach 2:
The adhesive is formulated with ionic liquids incorporated during manufacturing, preparing the adhesive structure in advance for electrical removal. This preliminary incorporation of ionic liquids ensures that when voltage is applied, the ion migration mechanism is already in place, enabling rapid bond failure without requiring lengthy solvent application and penetration times
3Length of stationary object
If the adhesive layer thickness is increased to 150 μm, then the adhesive can be applied in thick layers, but electrical removability becomes more difficult to achieve
Solution Approach 1:
The patent modifies the electrical field application parameters to match the increased adhesive thickness. The ionic liquid formulation, combined with adjusted voltage magnitude and application duration, ensures that the electrical field can penetrate through 150 μm thick adhesive layers and still trigger effective ion migration and bond failure, maintaining electrical removability despite increased thickness
4Ease of operation
If nitrogen-containing monomers are used to enable electrical removal, then adhesive strength can be reduced by voltage, but storage stability under warm humid conditions becomes challenging
Solution Approach 1:
The patent creates a composite adhesive system combining nitrogen-containing polymers with ionic liquids. This composite formulation leverages the polar nitrogen-containing polymer matrix to provide structural integrity and storage stability, while the incorporated ionic liquids enable the electrical removal function. The synergistic combination resolves the contradiction between electrical removability and storage stability
Solution Approach 2:
The ionic liquids act as intermediary substances that bridge the contradiction between electrical removability and storage stability. They are incorporated into the nitrogen-containing polymer matrix, providing the electrical response mechanism while the polymer matrix provides the structural stability needed for reliable storage under warm humid conditions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive compound achieves rapid, residue-free removal with voltage application, maintains high bond strength, and exhibits improved storage stability and reduced corrosion on metallic substrates.
Implementation Method 1
the adhesive strength of an adhesive mass by applying a voltage, wherein the adhesive mass contains polymeric microballoons based on polar monomers as well as a polymer matrix based on macromers and optionally polar monomers
Implementation Method 2
EP 3031875 B1 discloses the reduction of the adhesive strength of an acrylate adhesive by applying a voltage
Data Source
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AI summary
The invention relates to an adhesive compound, an adhesive tape, a bonded assembly, a method for electrically releasing the bonded assembly, and the use of the adhesive compound for bonding components in electronic devices, automobiles, medical devices, and dental devices. The adhesive compound contains a) at least one poly(meth)acrylate A, wherein the poly(meth)acrylate A is produced by polymerization of a monomer composition containing more than 15 wt.-% of one or more nitrogen-containing monomers, wherein the monomer composition optionally includes one or more alkylene oxide-containing poly(meth)acrylate monomers, provided that in this case none of the alkylene oxide-containing poly(meth)acrylate monomers has a molecular weight of more than 305 g/mol; and b) at least one electrolyte, wherein the electrolyte is selected from the group consisting of ionic liquids and metal salts, with ionic liquids being particularly preferred.