Electrical Assembly Sealing with Dual Insulator Walls
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing electrical assemblies in automotive transmission control modules face challenges in withstanding high thermal shock loads and protection from aggressive transmission fluids containing metal chips, leading to increased material costs and installation complexity due to the need for large receiving spaces for sealing compounds.
Innovation Solution
The creation of a receiving space with an inner wall formed by both insulating parts, allowing for a sealed compartment on at least five sides without requiring extensive integration into the overmolded lead frame, reducing installation space and material costs, and simplifying manufacturing and access to electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the receiving space is designed as a trough-shaped depression on at least five sides to prevent potting compound leakage, then the sealing reliability is improved, but the installation space and support thickness increase
Solution Approach 1:
The invention merges the receiving space structure with the housing itself by forming a recess directly in the housing that receives the potting compound. This eliminates the need for a separate trough-shaped depression structure, achieving sealing reliability while minimizing installation space and support thickness requirements.
2Object-affected harmful factors
If the receiving space is integrated into the overmolded lead frame to seal the potting compound, then the protection against transmission fluid is improved, but the manufacturing complexity and material costs increase
Solution Approach 1:
The invention segments the protection function by using the housing structure itself to form the receiving space for the potting compound, rather than integrating it into the overmolded lead frame. This separation simplifies manufacturing while maintaining protection against transmission fluid and metal chips through the combined housing-recess-potting compound system.
3Reliability
If the first insulating part is designed with a complete frame structure to form the receiving space, then the sealing capability is improved, but the overall height and material usage increase
Solution Approach 1:
The invention extracts the receiving space function from the first insulating part's frame structure and transfers it to the housing. The housing is provided with a recess that serves as the receiving space for the potting compound, eliminating the need for the first insulating part to have a complete frame structure, thereby reducing overall height and material usage while maintaining sealing capability.
Data Source
Figure 1~2
Figure 3~4
Figure 5~6
AI summary
The invention relates to an electrical assembly, comprising: a first electrical component (10), which has at least one first conductor (11), which is arranged in a first insulating part (12) and has at least one free conductor end (13), which protrudes from the first insulating part (12); a second electrical component (20), which is produced independently of the first electrical component (10) and which has at least one second conductor (21), which is arranged in a second insulating part (22) and which has at least one free conductor end (23), which protrudes from the second insulating part (22); and an accommodating chamber (32), which is formed on the electrical assembly (1) and in which an electrical contact point (31) between the first conductor (13) and the second conductor (23) is arranged, wherein the accommodating chamber (32) is filled at least partially with a potting mass (33) in such a way that the contact point (31) and the free conductor ends (13, 23) of the first conductor (11) and of the second conductor (21) are covered by the potting mass (33) and the potting mass (33) is bounded by an inner wall (36) of the accommodating chamber (32) on at least five sides. According to the invention, the inner wall (36) of the accommodating chamber (32) is formed by wall surfaces (16, 26) both of the first insulating part (12) and of the second insulating part (22).