Electrical component and refrigeration device
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Solution Overview
Problem
Existing refrigeration apparatuses face inefficiencies in cooling electrolytic capacitors due to sealed housings that reduce air circulation, leading to less effective cooling and increased component costs or attachment complexity when using heat sinks for heat dissipation.
Innovation Solution
The use of a common heat sink for both electrolytic capacitors and power modules, combined with insulation and flexible heat dissipating members, enhances heat dissipation through the housing and leads, reducing component costs and attachment complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the housing is sealed to reduce foreign matter and water droplet entry, then reliability is improved, but cooling efficiency of the electrolytic capacitor deteriorates due to reduced air circulation
Solution Approach 1:
The patent combines the heat dissipation functions of the power module and electrolytic capacitor into a single integrated heat sink structure. The heat sink includes a power module heat dissipation plate attached to the power module, and electrolytic capacitor heat dissipation plates attached to the capacitor leads, all merging into one thermal management system that operates within the sealed housing.
Solution Approach 2:
The heat sink structure serves multiple functions simultaneously: it dissipates heat from both the power module and electrolytic capacitor, provides structural support for mounting these components, and facilitates heat transfer from multiple heat-generating components through a unified thermal pathway to the housing and external environment.
2Temperature
If separate heat sinks are used for power module and electrolytic capacitor, then heat dissipation effectiveness is improved, but device complexity and component cost increase
Solution Approach 1:
The patent combines the heat dissipation functions of the power module and electrolytic capacitor into a single integrated heat sink structure. The heat sink includes a power module heat dissipation plate attached to the power module, and electrolytic capacitor heat dissipation plates attached to the capacitor leads, all merging into one thermal management system.
Solution Approach 2:
The heat sink structure serves multiple functions simultaneously: it dissipates heat from both the power module and electrolytic capacitor, provides structural support for mounting these components, and facilitates heat transfer from multiple heat-generating components through a unified thermal pathway to the housing and external environment.
3Temperature
If separate heat sinks are used for power module and electrolytic capacitor, then heat dissipation effectiveness is improved, but manufacturing cost increases
Solution Approach 1:
The patent combines the heat dissipation functions of the power module and electrolytic capacitor into a single integrated heat sink structure. The heat sink includes a power module heat dissipation plate attached to the power module, and electrolytic capacitor heat dissipation plates attached to the capacitor leads, all merging into one thermal management system.
Solution Approach 2:
The heat sink structure serves multiple functions simultaneously: it dissipates heat from both the power module and electrolytic capacitor, provides structural support for mounting these components, and facilitates heat transfer from multiple heat-generating components through a unified thermal pathway to the housing and external environment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves heat dissipation efficiency, reduces component costs, and minimizes noise transmission while maintaining a compact design, thus enhancing the performance and cost-effectiveness of the refrigeration apparatus.
Implementation Method 1
heat is conducted from the electrode to the heat dissipation fins through the copper foil
Implementation Method 2
the heat from the power module can be dissipated by a heat sink
Implementation Method 3
the electrolytic capacitor can be cooled by the air circulating in the housing
Data Source
Figure 1
Figure 2~3
Figure 4~6
AI summary
A technique for dissipating heat from a plurality of components is proposed. An electric component (1) includes a substrate (400), a first component (412), a second component (401), and a heat sink (31). The substrate (400) has a first surface (400b) and a second surface (400a) opposite to the first surface (400b). The first component (412) is disposed on a side of the first surface (400b). The second component (401) includes a body (401a) disposed on a side of the second surface (400a), and a lead (401b) that extends from the body (401a) through the second surface (400a) to the first surface (400b). The heat sink (31) is disposed on the side of the first surface (400b), and is used in common for dissipation of heat from the body (401a) through the lead (401b) and dissipation of heat from the first component (412) .