Electrical Component with Segmented Electrodes for Embedded Carrier Integration
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing electrical components with ceramic base bodies face challenges in reliable protection against chemical and mechanical influences when embedded in carriers, such as printed circuit boards, and require effective electrical and thermal connections.
Innovation Solution
The electrical component features a ceramic base body with an electrically insulating passivation layer and external electrodes comprising a first metal electrode layer, typically silver or silver-palladium, and a second copper electrode layer applied through a galvanic or electrochemical process, ensuring protection and reliable contacting, with copper vias and connection contacts for enhanced electrical and thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a passivation layer with a single metal electrode layer is used, then the base body is protected from chemical influences, but reliable electrical contacting of internal electrodes is insufficient
Solution Approach 1:
The electrode structure is segmented into two distinct layers: a first electrode layer (silver or silver-palladium) for reliable electrical contact with internal electrodes, and a second electrode layer (copper) for connection to external contacts. This segmentation allows each layer to perform its specific function optimally, resolving the contradiction between contact reliability and structural simplicity.
Solution Approach 2:
The electrode assembly uses a composite structure combining different metal materials with complementary properties. The silver-based first layer provides excellent electrical contact and corrosion resistance, while the copper second layer provides good conductivity and cost-effectiveness. This composite approach enhances overall reliability without requiring a single complex material.
2Adaptability or versatility
If the component is embedded in a carrier during lamination process, then integration is improved, but the base body is exposed to moisture and process media causing chemical degradation
Solution Approach 1:
The passivation layer is applied to the base body before embedding in the carrier, creating a protective barrier in advance. This preliminary protective action prevents moisture and process media from reaching the base body during the lamination process and subsequent operation, allowing the component to be successfully embedded without degradation.
Solution Approach 2:
The passivation layer acts as an intermediary barrier between the base body and the harmful environment (moisture, process media). This intermediate layer protects the base body from direct exposure to chemical and mechanical influences while still allowing the component to be embedded in the carrier for integration.
3Reliability
If a copper layer is applied through galvanic or electrochemical process, then electrical and thermal conductivity is improved, but the manufacturing process complexity increases
Solution Approach 1:
The mechanical process of applying copper (such as screen printing or paste deposition) is replaced with a galvanic or electrochemical deposition process. This substitution enables precise control of copper layer thickness and composition, ensuring optimal electrical and thermal conductivity while maintaining manufacturability through automated electrochemical processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration provides robust protection against environmental influences and ensures reliable electrical and thermal connections, enabling efficient embedding and performance of the component within a carrier, particularly during lamination processes.
Implementation Method 1
The second electrode layer is applied in a galvanic or electrochemical process. In this case, a metal is deposited from a solution on the first electrode layer. In a galvanic process, an external power source is connected for this purpose.
Implementation Method 2
The second electrode layer is applied in a galvanic or electrochemical process. In this case, a metal is deposited from a solution on the first electrode layer. In an electrochemical process, the metal is deposited without current.
Data Source
Figure 1~2
AI summary
The invention relates to an electrical component (1) for embedding into a carrier (9). The component comprises a ceramic main part (2), an electrically-insulating passivation layer (4) that is applied to said main part (2), and at least one inner electrode (3). The component (1) also comprises an outer electrode (5) which is connected to the inner electrode (3), said outer electrode (5) having a first electrode layer (6) which comprises a metal and a second electrode layer (7) which comprises copper and is arranged thereupon.