Electrical Component Terminal Surface Arrangement for Miniaturization
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing electrical components, such as duplexers, face challenges in miniaturization without compromising electrical performance, particularly in achieving effective grounding and minimizing capacitive and inductive coupling between signal and filter connections.
Innovation Solution
The design incorporates a common substrate with specific terminal surface arrangements and grounding strategies, including balanced terminal pairs, larger ground terminal surfaces, and optimized via connections to minimize capacitive and inductive coupling, allowing for miniaturization while maintaining electrical performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the component size is reduced for miniaturization, then the footprint area decreases, but the electrical performance degrades due to increased capacitive coupling and insufficient grounding
Solution Approach 1:
The patent applies local quality by creating asymmetric terminal surface arrangements where different regions of the substrate serve different functions. Ground terminal surfaces are strategically positioned at corners and edges with specific distances from signal connections, while signal and filter terminal surfaces are placed in optimized locations. This non-uniform distribution of terminal surfaces with different properties (grounding vs. signaling) resolves the contradiction by providing adequate grounding and minimizing capacitive coupling even in miniaturized configurations.
2Reliability
If ground terminal surfaces are positioned closer to signal connections to improve grounding, then grounding effectiveness increases, but capacitive coupling between signal and ground increases
Solution Approach 1:
The patent employs asymmetry by positioning ground terminal surfaces at specific asymmetric locations relative to signal connections. Corner ground surfaces are placed at defined distances from signal terminal surfaces, creating an asymmetric pattern that optimizes grounding while controlling capacitive coupling. This asymmetric arrangement allows the component to achieve effective grounding without excessive capacitive coupling that would occur with symmetric or uniformly close positioning.
3Reliability
If more terminal surfaces are added to improve connections, then connection quality improves, but the component footprint increases
Solution Approach 1:
The patent applies merging by integrating multiple terminal surfaces for different functions (ground, signal, filter connections) onto a single common substrate. The asymmetric arrangement allows ground, signal, and filter terminal surfaces to be combined in a compact configuration that provides high connection quality while maintaining a miniaturized footprint, avoiding the need for separate connection structures that would increase the overall area.
4Object-generated harmful factors
If terminal surfaces are positioned to minimize inductive coupling, then electromagnetic crosstalk reduces, but the arrangement complexity increases
Solution Approach 1:
The patent applies segmentation by dividing the terminal surface arrangement into distinct functional groups: corner ground surfaces, edge signal surfaces, and filter connection surfaces. This segmented approach systematically addresses electromagnetic crosstalk by positioning each group to minimize inductive coupling with others, while the overall asymmetric pattern provides a structured yet compact configuration that manages complexity.
Data Source
AI summary
An electrical component, e.g., a diplexer or a duplexer, can have one of a number of diverse arrangements for terminal surfaces on the substrate bottom. For example, the terminal surfaces for first and second filters are not disposed at the maximum distance from one another. First and second filters can be disposed as one or two discrete components on the substrate, wherein one filter can be implemented as being integrated in a multilayer substrate.