Electrical Connection Unit With Integrated Heat Conduction Structure
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Solution Overview
Problem
Existing electrical connection units face challenges in improving heat dissipation properties, which can lead to thermal management issues in electronic components.
Innovation Solution
The electrical connection unit incorporates a base portion with a flat surface featuring accommodation portions for a bus bar and a heat conduction portion, where the heat conduction portion is made of a material with higher thermal conductivity than the base member, ensuring effective heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional base member structure is used, then the device complexity is low, but the heat dissipation property is insufficient
Solution Approach 1:
The base member is segmented into multiple functional regions: a flat surface portion for holding components, a first accommodation portion for receiving the bus bar, and a second accommodation portion for receiving the heat conduction portion. This segmentation allows each region to serve its specific function optimally while maintaining an integrated structure that does not significantly increase device complexity.
Solution Approach 2:
The bus bar is nested within the first accommodation portion recessed in the flat surface portion, and the heat conduction portion is nested within the second accommodation portion. This nesting arrangement allows multiple components to be compactly integrated within the base member structure, improving heat dissipation functionality without proportionally increasing device complexity.
2Temperature
If a heat conduction portion with higher thermal conductivity is added, then the heat dissipation capability is improved, but the device complexity increases
Solution Approach 1:
The heat conduction portion is merged with the base member structure through the second accommodation portion, creating an integrated thermal management system. The heat conduction portion has higher thermal conductivity than the base member, and this combination allows efficient heat dissipation while maintaining structural integration rather than adding separate complex cooling systems.
Solution Approach 2:
The heat conduction portion acts as an intermediary between the electronic component and the base member, facilitating thermal energy transfer. This intermediary component with superior thermal conductivity bridges the thermal gap, improving overall heat dissipation capability while maintaining a relatively simple device structure through its integrated accommodation within the base member.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the heat dissipation capabilities of the electrical connection unit, effectively managing thermal loads in electronic components.
Implementation Method 1
The heat conduction portion has a thermal conductivity higher than that of the base member
Data Source
AI summary
An electrical connection unit includes a base portion, a bus bar, an electronic component, and a heat conduction portion. The base portion has a flat surface portion having a plate shape or sheet shape. A first accommodation portion recessed in a thickness direction of the flat surface portion or penetrating the flat surface portion in the thickness direction is formed in the flat surface portion. The bus bar is held by the flat surface portion. The electronic component faces the base member and is electrically connected to the bus bar. The heat conduction portion is electrically insulated from the bus bar and the electronic component, and is held by the base member in a state of being accommodated in the first accommodation portion. The heat conduction portion has a thermal conductivity higher than that of the base member.