Electrical Contact Array With Displaced Mounting Positions
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Solution Overview
Problem
Conventional electrical connecting apparatuses for semiconductor integrated circuits face challenges in adhering contacts to mounting portions without damaging adjacent areas due to heat, leading to increased pitch and reduced contact density.
Innovation Solution
The apparatus features alternately positioned mounting portions and contacts on a base plate, with displaced mounting positions in a second direction to prevent heat damage, and includes elastically deformable arm portions and projections to ensure equal needle pressure and reduce electrical interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If contacts are adhered to mounting portions by soldering or welding, then contacts can be firmly mounted, but adjoining mounting portions are damaged by heat requiring larger arrangement pitch
Solution Approach 1:
The patent introduces a second direction (Y-direction) perpendicular to the conventional single-row arrangement (X-direction). Mounting portions are arranged in a matrix pattern with alternating positions in the first direction and displaced positions in the second direction. This two-dimensional arrangement increases the distance between adjacent mounting portions, allowing heat from soldering or welding one contact to dissipate without damaging neighboring mounting portions, thus enabling smaller overall pitch while maintaining adhesion strength.
Solution Approach 2:
The contact array is segmented into multiple groups (first, second, third, fourth contact groups) with different arrangement patterns. Each group has mounting portions arranged alternately in the first direction with displacements in the second direction. This segmentation allows different regions to be processed independently, reducing thermal interference between adjacent mounting operations.
2Quantity of substance
If arrangement pitch of contacts is reduced to increase contact density, then more contacts can be mounted on the base plate, but heat from mounting damages adjoining mounting portions
Solution Approach 1:
By arranging mounting portions in a two-dimensional matrix pattern with alternating positions in the first direction and displacements in the second direction, the patent achieves higher contact density without increasing thermal interference. The displaced arrangement in the second direction ensures sufficient thermal spacing while maintaining compact overall dimensions, allowing more contacts to be mounted on the same base plate area.
Solution Approach 2:
The mounting portions are pre-positioned in an alternating pattern with built-in thermal spacing before the actual contact mounting process. This preliminary arrangement ensures that when contacts are soldered or welded, the heat affects only the immediate mounting portion and not adjacent ones, enabling higher density without thermal damage.
3Device complexity
If contacts are arranged in a single row with coincident mounting positions, then the structure is simple, but heat damage requires larger arrangement pitch
Solution Approach 1:
The patent extends the conventional single-row arrangement by introducing a second directional component. Mounting portions are arranged alternately in the first direction with displacements in the second direction, creating a staggered matrix pattern. This maintains relative structural simplicity while effectively increasing spacing between thermal zones, allowing smaller pitch without proportionally increasing complexity.
Data Source
AI summary
An electrical connecting apparatus comprises: a base plate provided with a first and a second mounting portion groups respectively having a plurality of first and second mounting portions arranged so as to be alternately positioned in a first direction; and a first and a second contact groups respectively having a plurality of first and second contacts individually mounted on the first and second mounting portions and in a cantilever state, the first and second contacts being displaced from each other in a second direction intersecting the first direction at the mounting positions on the base plate. This prevents any damage to adjacent mounting portions due to heat at the time of mounting the contacts, so that an arrangement pitch of the contacts can be made small.