Electrical Contact Element Manufacturing for RF Circuit Interconnects
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Connecting high-frequency circuitry, such as inner conductors of connectors or ports, to conductors or traces in RF circuits becomes increasingly difficult as the sizes of the elements diminish with increasing signal frequencies, leading to mechanical instability and suboptimal connection configurations.
Innovation Solution
A method for manufacturing electrical contact elements involves depositing a separation layer on a carrier substrate with a circuit structure, forming a structuring layer with a predefined shape, adding an electrical contact element layer made of conductive material through the structuring layer, and then removing the separation and structuring layers, allowing for tailored, flexible connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If sliding contacts are used to connect inner conductors of RF ports to RF circuit conductors, then mechanical connection is achieved, but mechanical instability occurs with inner conductors of very small diameters (less than 1.0 mm or 0.8 mm)
Solution Approach 1:
The patent replaces the mechanical sliding contact system with a deposited electrical contact element layer that is directly formed on the circuit structure. This eliminates the mechanical instability of sliding contacts by using a fixed, deposited connection method that maintains reliability even with very small inner conductor diameters.
Solution Approach 2:
The electrical contact element layer is deposited in advance on the circuit structure before the inner conductor is positioned. This preliminary action ensures that the connection is already prepared and fixed, avoiding mechanical instability during the connection process with small-diameter conductors.
2Adaptability or versatility
If uniform mesh pattern gold ribbons are used for connection, then standardization is achieved, but optimal configuration for each electrical connection cannot be realized
Solution Approach 1:
The patent applies local quality by allowing the electrical contact element layer to have different patterns, densities, and configurations in different regions of the circuit structure. This enables each electrical connection to be optimized for its specific requirements rather than using a uniform mesh pattern everywhere.
Solution Approach 2:
The patent enables parameter changes by allowing the electrical contact element layer to be deposited with varying thickness, material composition, and geometric patterns at different locations. This provides adaptability for optimal configuration of each electrical connection while maintaining a relatively simple deposition process.
3Adaptability or versatility
If separation layer and structuring layer are used to manufacture electrical contact elements, then tailored and flexible connections are achieved, but additional manufacturing steps are required
Solution Approach 1:
The separation layer is deposited in advance to define the regions where the electrical contact element layer will be formed. The structuring layer is then added with a predefined structure that guides the deposition pattern. These preliminary actions enable tailored connections while organizing the manufacturing process into systematic steps.
Solution Approach 2:
The separation layer and structuring layer act as intermediaries that facilitate the manufacturing of customized electrical contact elements. The separation layer provides a base for selective deposition, while the structuring layer defines the final pattern. These intermediary layers are removed after serving their purpose, having enabled the customization without permanently adding complexity to the final product.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the creation of ready-to-use, individually tailored electrical contact elements that can efficiently interconnect various circuit elements, even those with very small diameters, providing mechanical flexibility and optimal RF characteristics.
Implementation Method 1
depositing a separation layer on a carrier substrate that comprises the circuit structure
Implementation Method 2
adding an electrical contact element layer by depositing electrically conductive material on the basic layer via the structuring layer
Data Source
AI summary
The present disclosure provides a method for manufacturing an electrical contact element on a circuit structure, the method comprising depositing a separation layer on a carrier substrate, wherein the carrier substrate comprises the circuit structure, forming a structuring layer with a predefined structure on a basic layer that is arranged between the separation layer and the structuring layer, adding an electrical contact element layer by depositing electrically conductive material on the basic layer via the structuring layer according to the predefined structure, and removing the separation layer, and the structuring layer. Further, the present disclosure provides a respective measurement application device.