Electrical Crack Detection in Conductive Materials
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Solution Overview
Problem
Existing methods for detecting cracks or defects in conductive or semiconductive materials, such as ceramic body plating used in armor, are often expensive, bulky, and not portable, making them impractical for field use, while X-ray scanning techniques are costly and time-consuming.
Innovation Solution
A measurement system utilizing an electrical signal source, a plurality of electrical contacts, and a control module to determine the presence of cracks or defects by measuring electrical signal parameters across resistors, allowing for the use of simpler and more portable equipment compared to X-ray radiography or CT scanning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If X-ray scanning or X-ray CT scanning is used to detect cracks or defects in materials, then measurement precision is improved, but device complexity and cost increase
Solution Approach 1:
The patent replaces complex mechanical X-ray scanning systems with an electrical measurement system that uses electrical contacts and signal analysis to detect cracks and defects in conductive or semiconductive materials, thereby reducing device complexity while maintaining measurement precision
Solution Approach 2:
The patent creates an electrical model or representation of the material's internal structure by measuring electrical properties (such as conductivity or resistance) at multiple points, allowing defect detection without requiring physical penetration or complex imaging equipment
2Measurement precision
If X-ray scanning or X-ray CT scanning is used to detect cracks or defects in materials, then measurement precision is improved, but loss of time increases
Solution Approach 1:
The patent replaces time-consuming X-ray scanning processes with rapid electrical measurements that can be taken instantaneously at multiple points, significantly reducing the time required for defect detection while maintaining accuracy
3Measurement precision
If X-ray scanning or X-ray CT scanning is used to detect cracks or defects in materials, then measurement precision is improved, but cost increases
Solution Approach 1:
The patent replaces expensive X-ray equipment with inexpensive electrical measurement devices, achieving the same defect detection capability at a fraction of the cost
Solution Approach 2:
The patent uses simple, inexpensive electrical contacts and measurement circuits that can be easily manufactured and replaced, eliminating the need for costly, specialized X-ray equipment
4Ease of operation
If portable equipment is used for crack detection in field conditions, then ease of operation is improved, but measurement precision deteriorates
Solution Approach 1:
The patent uses electrical measurement principles that can be implemented in compact, portable devices, enabling field operations without sacrificing detection accuracy
Solution Approach 2:
The patent creates a measurement system that can be deployed in various field conditions and adapted to different material types, providing both portability and precision through electrical property measurements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system provides cost-effective and portable means to detect cracks or defects in materials, offering sufficient accuracy and detail for field use, while reducing temperature effects and enabling the use of data from intact materials to assess structural integrity.
Implementation Method 1
causing the electrical signal source to output an electrical signal to the input electrical contact; causing a respective electrical signal parameter to be determined at a respective resistor associated with each respective extraction electrical contact
Data Source
AI summary
A measurement system may include an electrical signal source; a plurality of electrical contacts electrically coupled to a tested material; a respective resistor associated with each electrical contact; a common node to which the respective resistors are electrically connected; and a control module. The control module may cause the electrical signal source to be electrically connected to a selected electrical contact as an input electrical contact. The remaining electrical contacts are electrically connected to a return node of the electrical signal source as extraction electrical contacts. The control module also may cause the electrical signal source to output an electrical signal to an input electrical contact; cause a respective electrical signal parameter to be determined at the respective resistor associated with each respective extraction electrical contact; and determine whether the tested material includes a crack or other defect based on the respective electrical signal parameters.