Electrical Device Edge Slits Prevent Metallization Shorts
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Solution Overview
Problem
Electrical devices used for stimulating and characterizing samples during electron microscope imaging often experience unwanted electrical shorts and circuit paths due to inadvertent metallization, compromising the integrity of electrical testing.
Innovation Solution
An electrical device with a slit defined through its chip, positioned between conductive contacts, minimizes the risk of unwanted metallization by allowing particle beams to pass through, preventing residual metal accumulation and thus reducing the likelihood of electrical shorts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If FIB metal deposition is used to establish electrical connections to the sample, then electrical connections are improved, but unwanted metallization of the membrane or surrounding chip portions occurs causing electrical shorts
Solution Approach 1:
The chip is divided into isolated regions by slits that segment the conductive paths. This prevents continuous metallization across the entire chip, confining any unwanted metal deposition to isolated areas that cannot create short circuits between different electrical regions.
Solution Approach 2:
Material is removed to create slits that extract the problematic continuous conductive path from the system. By removing chip material to form deep slits, the patent eliminates the continuous substrate that would otherwise allow unwanted metallization to bridge between electrical contacts.
2Strength
If the chip structure is made thicker to provide better support, then mechanical strength is improved, but the risk of unwanted metallization and electrical shorts increases
Solution Approach 1:
The thicker chip is segmented by deep slits that extend through most of the chip thickness, creating isolated islands of conductive material. This allows the chip to maintain overall mechanical strength while preventing continuous electrical paths that would cause shorts.
Solution Approach 2:
The chip structure has different properties in different regions: thick support areas maintain mechanical strength while slit regions create electrical isolation. The local quality of the chip varies from solid support structures to slit-filled isolation zones, optimizing both strength and electrical isolation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device effectively prevents electrical leaking and ensures reliable electrical connections by forming a material void through the slit, ensuring accurate electrical measurements during electron microscope imaging.
Implementation Method 1
the sample is electrically connected to the wires by FIB (focused ion beam) metal deposition
Implementation Method 2
the slit is at least partially positioned between the first contacts and second contact... allowing particle beams to pass through
Data Source
AI summary
An electrical device for electrically measuring a sample during electron microscope imaging includes: a chip through which a slit is defined, the chip having at least one peripheral edge, the slit having an open end at the at least one peripheral edge; an electrically conductive first contact on the chip; and an electrically conductive second contact on the chip; wherein the slit is at least partially positioned between the first contacts and second contact. An electrically conductive first wire may extend along the chip electrically connected to the first contact; and an electrically conductive second wire may extend along the chip electrically connected to the second contact. The first wire and second wire may diverge from each other in extending along the chip away from the slit.