Electrical-to-Optical Converter Module With 200 Gb/s PCB Bypass
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Solution Overview
Problem
Current chip-to-chip transmission methods face limitations in maintaining high signal quality over longer distances due to signal degradation through copper cables and PCBs, especially at data rates above 100 Gb/s, which is undesirable in weight-sensitive applications.
Innovation Solution
An electrical-to-optical converter module that integrates a high-speed substrate with fiber-pigtailed or fiber-connectorized converters, allowing data signals to bypass PCB tracks and directly transition to optical transmission, maintaining signal integrity over distances up to 10 m with multimode VCSELs and potentially further with single-mode VCSELs or Silicon photonics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If copper cable connections are used for chip-to-chip transmission, then the system is simple and lightweight, but signal quality degrades rapidly beyond 1 meter at 200 Gb/s data rates
Solution Approach 1:
The patent replaces the electrical copper cable transmission system with an optical fiber transmission system. The electrical signals from the ASIC chip are converted to optical signals through edge-emitting lasers in an optical module, transmitted through optical fiber cable, and converted back to electrical signals at the destination. This substitution of electrical transmission with optical transmission enables high-quality signal transmission over distances up to 1 km, overcoming the 1 meter limitation of copper cables at 200 Gb/s data rates.
2Length of stationary object
If pluggable optical modules are used to extend transmission distance, then signal quality is maintained over longer distances, but the signals must pass through PCB tracks which degrades signal quality
Solution Approach 1:
The patent extracts the optical conversion functionality from the traditional PCB-based pluggable module architecture and integrates it directly into a co-packaged configuration with the ASIC chip. The optical module is mounted on the same high-speed substrate as the ASIC chip, allowing electrical signals to be converted to optical signals without passing through low-speed PCB tracks. This extraction of the conversion function from the PCB path eliminates the signal quality degradation that occurs when signals traverse PCB traces at high data rates.
Solution Approach 2:
The patent merges the ASIC chip and optical module into a single co-packaged unit on the same high-speed substrate. This integration creates a unified transmission system where the electrical-to-optical conversion happens in close proximity to the signal source, eliminating the need for signals to travel through intermediate PCB connections. The merging of these components achieves both long transmission distance (up to 1 km) and high signal quality by removing the PCB track degradation path from the signal path.
3Ease of manufacture
If copper cable connections are used, then the setup is simple, but the weight becomes undesirable in weight-sensitive applications like aircraft or satellites
Solution Approach 1:
The patent substitutes heavy copper cable connections with lightweight optical fiber cables. Optical fibers are significantly lighter than copper cables of equivalent transmission capability, making them suitable for weight-sensitive applications such as aircraft and satellites. The substitution maintains system simplicity through the use of standard optical module interfaces and established fiber optic infrastructure, while dramatically reducing the weight of the transmission medium.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides an order of magnitude improvement in reachable distance with higher signal integrity, enabling 200 Gb/s signals to travel up to 10 m without degradation and potentially 2 orders of magnitude improvement with advanced technologies, while offering flexibility and convenience by allowing components to be plugged in only when needed.
Implementation Method 1
fiber-pigtailed or fiber-connectorized converters, allowing data signals to bypass PCB tracks and directly transition to optical transmission, maintaining signal integrity over distances up to 10 m with multimode VCSELs
Data Source
AI summary
An electrical to optical converter module has one or more fiber pigtailed or fiber connectorized electrical to optical converters; and a substrate configured to carry signals at data rates at or above 100 Gb/s. The substrate connects to the one or more fiber pigtailed or fiber connectorized electrical to optical converters, to an electrical socket that provides signals at data rates at or above 100 Gb/s, and to a DC socket module mounted on a PCB. In some cases, the substrate and the electrical socket are configured to incur signal losses lower than 1 dB/inch while carrying signals at data rates at or above 100 Gb/s.